WORLD-CLASS MANUFACTURING

Competitiveness through Productivity

300mm wafers have over twice the usable area as 200mm wafers, delivering productivity advantages of up 2.5 times the number of chips. This translates directly into greater competitive advantages for our customers. UMC's 300mm facilities utilize state-of-the-art computer integrated manufacturing (CIM), which together with our extensive 300mm experience, has allowed UMC to achieve 300mm yields and cycle times comparable to our 200mm manufacturing.

Larger Die Sizes More Efficiently Utilize 300mm Wafer Area

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