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| Dec. 18, 2001 |
UMC
Statement Regarding Recent Taiwan Earthquake |
| Dec. 5, 2001 |
UMC
Raises $302 Million Through Zero-Coupon Convertible Bond Offering
|
| Dec. 3, 2001 |
SONICS,
NOKIA, TEXAS INSTRUMENTS, MIPS, and UMC Launch OCP-IP to Standardize
IP Core Socket Interface |
| Nov.26, 2001 |
XILINX
and UMC Announce Successful Production on 300-mm Wafers |
| Oct. 30, 2001 |
UMC
3Q 2001 Financial Results |
| Oct. 29, 2001 |
Mysticom,
UMC Partner to Enable the Development of Highly Integrated, Communications
SOCs with Mysticom's 10/100 Ethernet Physical Layer Core |
| Oct. 10, 2001 |
Flextronics
Semiconductor Joins UMC's ASICplus Program |
| Oct. 8, 2001 |
Micronas
Selects UMC's Fabs for Production of World's First Hybrid Analog/Digital
TV Decoder Chip |
| Oct. 5, 2001 |
UMC
Revises its 2001 Financial Forecast |
| Oct. 4, 2001 |
Lightcross,
Inc. and UMC Successfully Fabricate New Class of Photonics Components |
| Sept. 24 , 2001 |
UMC
Extends Range of 1T-SRAM® Memory Macros |
| Sept. 4 , 2001 |
Conexant
and UMC Sign a Long-term Semiconductor Wafer Supply Agreement |
| July 31, 2001 |
UMC
2Q 2001 Financial Results |
| July 23, 2001 |
UMCi
Announces 300mm Fab Construction Contract Awarded to Kajima Overseas
Asia Pte. Ltd. |
| July 17, 2001 |
Alcatel
Selects UMC's 0.13-Micron Technology for Advanced Communication Products |
| July 9, 2001 |
AMCC
Selects UMC's 0.13-Micron Technology for the Development of Next-Generation
Optical Networking Silicon |
| June 15,, 2001 |
UMC
Mid-Quarter Business Update for the Second Quarter of 2001 |
| June 14, 2001 |
UMC
Statement regarding Recent Taiwan Earthquakes |
| June 11, 2001 |
SiberCore
Technologies and UMC Announce Fabrication of World's Highest Density
Ternary CAM |
| June 6, 2001 |
UMC
Re-focuses Top Management |
| June 4, 2001 |
UMC's
ASICplus Program Chosen by Zucotto Wireless Inc. for Development of
Its Xpresso Family of Java Technology-Based Processors
|
| May
11, 2001 |
UMC
Introduces Remote Layout Viewer: Component of e-Services Suite Facilitates
Design Rule Check (DRC) Signoff |
| May
02, 2001 |
XILINX
Announces Products on 300mm Wafers with UMC's Joint Venture Fab, TRECENTI |
| Apr.
30, 2001 |
UMC
1Q 2001 Financial Results |
| Apr.16,
2001 |
UMC's
0.13-Micron Technology Enables Next Generation Semiconductor Applications
with Innovative "Fusion" Design Option |
| Apr.12,
2001 |
UMC
Holds Groundbreaking Ceremony for 300-mm Semiconductor Foundry in
Singapore |
| Apr.
9, 2001 |
Sharp
Microelectronics of the Americas Utilizes UMC's Silicon Shuttle Program
for Microcontroller and System-on-Chip Designs |
| Apr.
9, 2001 |
UMC,Synopsys
and Virtual Silicon Collaborate to Help Customers Get From Design
Specification to silicon more Quickly |
Mar. 27, 2001
|
UMC
Board Directors Proposes NT$ 1.5 Stock Dividend |
Feb 28, 2001
|
International
Trade Commission Votes to Investigate Claims of SIS Infringement of
UMC Patents |
Feb 22, 2001
|
UMC
First Foundry to Implement RosettaNet Stabdards for e-Business Supply
Chain Management Solutions |
| Feb 19, 2001 |
Mentor
Graphics and UMC Deliver IC Design Kits Through Expanded Partnership
|
| Feb 15, 2001 |
UMC
and Giga Solution Combine to Offer RF/Mixed-mode Design Kits for 0.25um,
0.18um |
| Feb 14, 2001 |
UMC
4Q 2000 Financial Results |
| Feb 12, 2001 |
Three-Five
Systems Builds Microdisplays on UMC's Unique Liquid Crystal on Silicon(LCoS)
Semiconductor Process |
| Jan 30, 2001 |
Singapore's
Economic Development Board to Take Equity Stake in UMC's 300mm Singapore
Project |
| Jan 8, 2001 |
UMC
Targets Camera-on-a-Chip Developers with Enhanced CMOS Image Sensor
Technology |
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