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UMC Group Japan Established as New Regional Sales Hub

Tokyo-based office will support existing customers and help expand UMC's customer base in Japan

 

Hsinchu, Taiwan, March 1, 2013 – United Microelectronics Corporation (NYSE: UMC; TSE: 2303) ("UMC"), a leading global semiconductor foundry, today announced that it has established UMC Group Japan, a regional sales office that will directly support the company's regional customers. UMC's current Japan customers will enjoy local service to help expedite their business needs while the company also expands its current footprint in the Japan market.

W.Y. Chen, COO of UMC said, "Japan's increasing fabless and fablite trend creates new opportunities for both UMC and local tech companies looking to outsource their manufacturing to one of the world's most established semiconductor foundries. The Japan office will allow us to deliver the timely, quality support expected by our local customers while also serving as a base to cultivate new foundry business for UMC."

About UMC
UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry that provides advanced technology and manufacturing for applications spanning every major sector of the IC industry. UMC's robust foundry solutions allow chip designers to leverage the company's leading-edge processes, which include 28nm poly-SiON and gate-last High-K/Metal Gate technology, mixed signal/RFCMOS, and a wide range of specialty technologies. Production is supported through 10 wafer manufacturing facilities that include two advanced 300mm fabs; Fab 12A in Taiwan and Singapore-based Fab 12i. Fab 12A consists of Phases 1-4 which are in production for customer products down to 28nm. Construction is underway for Phases 5&6, with future plans for Phases 7&8. The company employs over 13,000 people worldwide and has offices in Taiwan, Japan, China, Singapore, Europe, and the United States. UMC can be found on the web at http://www.umc.com.

Note from UMC Concerning Forward-Looking Statements
Some of the statements in the foregoing announcement are forward looking within the meaning of the U.S.  Federal Securities laws, including statements about future outsourcing, wafer capacity, technologies, business relationships and market conditions.  Investors are cautioned that actual events and results could differ materially from these statements as a result of a variety of factors, including conditions in the overall semiconductor market and economy; acceptance and demand for products from UMC; and technological and development risks.  Further information concerning these risks is included in UMC's filings with the U.S. SEC, including on Form F-1, F-3, F-6 and 20-F, each as amended.


 

 

UMC
UMC Corporate Communications
Richard Yu
+886-2-2658-9168 ext. 16951
richard_yu@umc.com

 

   

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