Hsinchu, Taiwan, April 20, 2015 - United Microelectronics Corporation (NYSE: UMC; TSE: 2303) ("UMC"), a leading global semiconductor foundry, today announced that its global offices in Hsinchu, Tainan, Singapore, Japan, China, USA and Europe will hold green, environmental-friendly activities on Earth Day each year and celebrate each April 20th as UMC Global Green Day.

This year the major event was a tree-planting activity held in Tainan's Fab 12A. UMC CEO Mr. Po Wen Yen led executives and employees to plant trees at Fab 12A Phase 5 as a symbol of green commitment. Meanwhile, the company also announced its “UMC Green 2020” goals to demonstrate its long-term commitment to sustainable environment. The entire event was conducted by the lowest-possible carbon emission manner, with all activities having been carbon footprint verified, and offset by UMC's carbon credits.

UMC CEO Mr. Po Wen Yen said, “Taiwan is currently faced with the most serious drought seen in years. This type of abnormal climate will become the norm in the future. UMC has long-term commitment on energy-saving, carbon-reduction, and the saving and reuse of water, with a water recycling rate for fabs reaching 88%. 2000 megatons of water are recycled annually, which equals to the annual usage of 50 thousands households. We will be more proactive with self-motivated action and more stringent standards. The goal is to further reduce water, energy, and waste by 10% over current levels by 2020, the 40-year anniversary of the company. Furthermore, we encourage employees volunteer for green activities by providing paid-volunteer-leave.”

UMC's “2015 Global Green” activities held at the company's global offices include tree planting, beach cleaning, meat-free days, car-free days, etc.

UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry that provides advanced technology and manufacturing for applications spanning every major sector of the IC industry. UMC's robust foundry solutions allow chip designers to leverage the company's leading-edge processes, which include 28nm poly-SiON and gate-last High-K/Metal Gate technology, mixed signal/RFCMOS, and a wide range of specialty technologies. Production is supported through 10 wafer manufacturing facilities that include two advanced 300mm fabs; Fab 12A in Taiwan and Singapore-based Fab 12i. Fab 12A consists of Phases 1-4 which are in production for customer products down to 28nm. Construction has been completed for Phases 5&6, with future plans for Phases 7&8. The company employs over 15,000 people worldwide and has offices in Taiwan, mainland China, Europe, Japan, Korea, Singapore, and the United States. UMC can be found on the web at http://www.umc.com.