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UMC Holds 2015 Japan Technology Forum

Foundry highlights technology and manufacturing solutions for IoT and automotive IC applications

 

Tokyo, Japan, May 27, 2015 – United Microelectronics Corporation (NYSE: UMC; TSE: 2303) ("UMC"), a leading global semiconductor foundry, today held its 2015 Japan Technology Forum to showcase the company's IoT and automotive IC manufacturing solutions to Japan-based semiconductor companies. Specifically, UMC's ultra-low power platform, engineered to maximize battery life in light of the “always on” characteristics of IoT products, will help Japanese customers penetrate the fast-growing IoT market with industry competitive products. In addition, the foundry's UMC AutoSM technology platform and highly secure, auto industry certified manufacturing will help Japanese chip designers capture new market opportunities for semiconductors used in vehicles.

“UMC has developed highly comprehensive services to enhance customer value for Japan-based semiconductor companies,”' said Po Wen Yen, CEO of UMC. “These include design support and back-end services through in-house resources as well as UMC ecosystem partners that help minimize entry barriers and speed time-to-market for Japanese customers entering high-growth IC segments such as IoT and auto. We also help customers minimize risk and ensure business continuity with geographically diverse manufacturing sites located throughout Asia, including Singapore, Taiwan and joint ventures in Japan and China. We look forward to bringing these robust foundry benefits to Japanese IC design companies, IDMs and system houses.”

Today's event, held at Tokyo International Forum in Tokyo, attracted over 250 semiconductor professionals from all across Japan.

About UMC
UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry that provides advanced IC production for applications spanning every major sector of the electronics industry. UMC's robust foundry solutions enable chip designers to leverage the company's sophisticated technology and manufacturing, which include 28nm gate-last High-K/Metal Gate technology, ultra-low power platform processes specifically engineered for Internet of Things (IoT) applications and the highest-rated AEC-Q11 Grade-0 automotive industry manufacturing capabilities. UMC's 10 wafer fabs are located throughout Asia and are able to produce over 500,000 wafers per month. The company employs over 17,000 people worldwide, with offices in Taiwan, mainland China, Europe, Japan, Korea, Singapore, and the United States. UMC can be found on the web at http://www.umc.com.

Note from UMC Concerning Forward-Looking Statements
Some of the statements in the foregoing announcement are forward looking within the meaning of the U.S. Federal Securities laws, including statements about future outsourcing, wafer capacity, technologies, business relationships and market conditions. Investors are cautioned that actual events and results could differ materially from these statements as a result of a variety of factors, including conditions in the overall semiconductor market and economy; acceptance and demand for products from UMC; and technological and development risks. Further information regarding these and other risks is included in UMC's filings with the U.S. Securities and Exchange Commission, including its registration statements and reports on Forms F-1, F-3, F-6 and 20-F and 6-K, in each case as amended. UMC does not undertake any obligation to update any forward-looking statement as a result of new information, future events or otherwise, except as required under applicable law.


 

 

UMC
UMC Corporate Communications
Richard Yu
+886-2-2658-9168 ext. 16951
richard_yu@umc.com

 

   

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