| UMC
Group Creates Industry's Most Complete 0.25- and 0.18-micron Design
Support Program Free-of-charge Design Offerings from Four Major Vendors
Sunnyvale,
Calif., Sept. 8, 1998 ¡V UMC Group said today it has finalized agreements
with leading library and intellectual property (IP) vendors to offer
the most comprehensive package of no-cost 0.25- and 0.18-micron
design kits and libraries in the foundry industry.
Artisan Components
and Mentor Graphics will distribute and support complete physical
libraries free of charge to UMC Group foundry customers, giving
both the front-end timing simulation and back-end physicals necessary
to perform a tape-out. In addition, Silicon Access, and Virtual
Silicon have agreed to support UMC Group customers with no-cost
front-end 0.25 micron design kits. Front-end design kits enable
a customer to size a design and determine basic timing data.
The Hsinchu-based
foundry also will provide verified system-on-chip IP from Mentor
Graphics, and other vendors. UMC Group's strategy is to provide
its customers with the libraries and low-risk IP from a wide range
of vendors to increase accessibility of design services and cut
time to market for customers.
"Since
last year we have been actively cooperating with a number of vendors
to establish a catalogue of libraries and system-on-chip IP tailored
specifically to UMC Group's 0.25 micron process," said Jim
Kupec, president of UMC Group (USA). "Our arrangements with
Artisan and Mentor Graphics to have physical libraries offered free-of-charge
is focused on ease of use, low risk, and cost effectiveness of our
foundry services."
New Silicon
Shuttle?Test Chip Program
UMC Group is
also offering its unique "Silicon Shuttle?" test chip
program, which facilitates IP checkout for customers and vendors
by allowing them to verify their IP in a test chip. "The program
has been heavily subscribed to, offering substantial benefits to
customers needing prototyping or IP verification for SOC designs.
Nine "Silicon Shuttle?" wafers have been completed to
date. We hope to increase our strategic partnerships with library
and IP vendors as the advantages of this business model become more
widely recognized," said Kupec.
"UMC Group
is the first major foundry to have a free-to-customers library agreement
with both Artisan Components and Mentor Graphics. UMC Group now
offers its customers two valuable options for 0.25 micron design
libraries - complete with standard cells, extensive I/O, and single-
and dual-port SRAM technologies," said Jim Ballingall, vice
president of worldwide marketing, UMC Group (USA).
"We believe
this library program is the first in the foundry industry to be
completely free of charges to the customer," added Ballingall.
"There are no license fees, use fees, instantiation fees. Furthermore,
both vendors will provide free standard support and maintenance
to customers for 12 months. As such, this program sets a new standard
for dedicated foundry service, complementing our leadership in deep
sub-micron manufacturing."
UMC Group's
strategic alliances with third-party IP vendors go beyond these
two complimentary library programs. Its "Silicon Shuttle?"
test-chip program allows IP vendors and fabless design firms to
prove their products in silicon at low or no cost, offering significant
benefits to IP vendors and foundry customers. UMC Group is also
manufacturing products from or otherwise cooperating with a wide
range of IP vendors, including Analog Circuit Technologies, Dolphin
Integration, Enabling Technology, LEDA Systems, Lexra, Pivotal Technologies,
Portability, Rambus, RocketChips, SiPCore, and SSL.
Availability
Both 0.25-micron
and 0.18-micron design kits are expected to be available by Q4 1998.
"We already
have completed a successful 0.18-micron test chip, and anticipate
a rich offering of design kits, libraries and IP available to support
our process in the very near future. Our strategic partnerships
with major players in the merchant library and IP field will be
key to helping customers remove to our leading edge process technology,"
said Kupec.
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