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UMC's Pro Foundry is a quarterly publication
offering the latest news from UMC, including technology updates,
featured events, and company highlights
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Pro
Foundry Issue 25(.pdf)
In this issue: Peter Chang Announces Retirement, UMC Wins 2007 National
Industrial Safety & Health Award, UMC's 65nm RFCMOS Process Now
Ready, UMC and ARM Deliver Comprehensive 65nm SOI Solutions, Elpida
and UMC To Develop Copper Low-K DRAM and PRAM Technologies, Melexis
and UMC Deliver Chips for Automobile Applications, UMC Produces World's
Smallest Silicon Tuner Device for MaxLinear, Magma and UMC Deliver
65nm Physical Verification and DFM Solution and Mentor Graphics and
UMC Deliver Analog Mixed-Signal Reference Flow. |
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Pro
Foundry Issue 24(.pdf)
In this issue: UMC Expands Global Customer Service Network with India
Office, UMC Expands Its Advanced Technology Complex in Tainan Science
Park, OKI, Faraday Technology and UMC/UMCJ Partner for Desing-to-Manufacture
Services, Cypress Announces Foundry Relationship with UMC, UMC's Enhanced
e-Mask System Streamlines Mask-tooling Process, Synopsys and UMC Enhance
90nm Reference Flow, UMC and Integrand Enhance 90nm and 0.13um RFCMOS
Design Offering, Magma and UMC Complete 65nm Library Characterization
Effort and Clear Shape and UMC Release DFM-Driven Design Flow |
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Pro
Foundry Issue 23(.pdf)
In this issue: UMC Achieves QC 080000 IECQ HSPM Qualification for
All Fabs, UMC Receives AIG's "Outstanding Risk Management Performance
Award", UMC and NDL Establish R&D Sponsorship Program, UMC
Produces Working 45nm ICs, UMC Delivers Leading-edge 65nm FPGAs to
Xilinx, Extreme DA and UMC Collaborate on sub-90nm Variation Aware
IC Design Flows, UMC Collaborates with NTU to Deliver RF Chip for
WiMax, UMC and IME to Partner on Advanced Noise Modeling for 90nm
Technologies and Cadence and UMC Deliver Silicon Validated Wireless
Reference Design. |
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Pro
Foundry Issue 22(.pdf)
In this issue: UMC Names Raymond Leung Vice President of Memory IP
Development, Xilinx Delivers Virtex 5 LX FPGA to its Customers, UMC
Delivers New SONOS Memory to Solid State Systems Co., UMC Announces
Readiness for 65-nanometer X Architecture Designs, Sidense to Deliver
OTP Cores in UMC's 90nm and 65nm Processes, UMC's Integrated DFM Solutions
Target Today's 90nm and 65nm SoC Designers, Impinj and UMC Deliver
Logic NVM Cores on 0.18um and 0.13um Processes and Silicon Image to
Port HDMITM Receiver IP Core to UMC's 90nm Process Technology.
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Pro
Foundry Issue 21(.pdf)
In this issue: UMC Sponsors FSA Suppliers Expo Taiwan as Platinum
Sponsor, UMC Europe Relocates Office to WTC Schiphol Amsterdam Airport,
RAMBUS and UMC Expand Availability of RAMBUS PCI Express PHY IP to
UMC's 90nm process, UMC and Integrand Bring Advanced Capabilities
to 0.13um RFCMOS Designers, UMC Introduces 90nm Reference Design Flow
and UMC Introduces Industry's Most Comprehensive Low-Power Design
Package.
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Pro
Foundry Issue 20(.pdf)
In this issue: UMC Celebrates 25th Anniversary, UMC Achieves Record
Milestone of Over 100,000 90nm Wafer Shipments, UMC Receives Top Award
for Sustainable Development from Taiwan's Executive Yuan, ARM to Provide
its Artisan Metro Low-power IP Platform for UMC's 0.13um Process,
UMC's R&D Team Extends Traditional Nitrided Gate-oxide to beyond
the 65nm Node, UMC Fabricates Record-Setting Voltage-Controlled Oscillator
Using CMOS Technology, Addressing Time to Market Challenges in the
SoC Era and 90nm BOAC Package Solution.
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Pro
Foundry Issue 19 (.pdf)
IIn this issue: Magma's QuickCap NX Extractor Available for UMC's
0.13um Process, UMC Expands X Architecture Support with Qualified
90nm Design Rules, UMC and Ansoft Deliver RFCMOS On-Chip Spiral Inductor
Library, JMicron Develops Serial ATA II (3.0 Gbps)PHY Core on UMC's
0.13um Process, UMC and Virage Logic Qualify Embedded Non-Volatile
Memory Technology on UMC's 0.18um Process, DFM in Practice at UMC
and Understanding TestKompress: Manufacturing Test Solution from Mentor
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Pro
Foundry Issue 18 (.pdf)
In this issue: UMC Receives Environmental Excellence Award, Lee Chung
Appointed VP of Corporate Marketing, UMC Low-Power SoC Solution, UMC
and Cadence Digital Reference Flow, UMC Offers Enhanced 0.13um and
90nm Silicon Shuttles, 0.18um 32 Volt High Voltage Process, 0.25um
Embedded EEPROM, Xilinx and UMC Develop Chips using 90nm Triple-Oxide
Technology, Ricoh Extends Partnership with UMC to 90nm and UMC Delivers
20 Million RADEON 9200 Chips to ATI.
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Pro
Foundry Issue 17 (.pdf)
In this issue :UMCi Moves to Full Scale Production, UMC Increases
Capacity with Fab Acquisition, Silicon Shuttle, CEVA Launches Foundry
Program with UMC, RF CMOS Challenges in SOC Implementation, ARM and
UMC Partnering to Enable Innovation, UMC Shipping D2Audio's Sophisticated
DSP ICs in Volume and UMC Delievers World's First ADM-on-a-Chip for
Parama Networks.
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Pro
Foundry Issue 16
(.pdf)
In this issue: UMCJ Invest in UMCi for
Technology and Manufacturing, 90nm Silicon Success using Chromeless
Mask Technology, UMC Introduces Breakthrough RFCMOS Methodology, UMC
Joins X-Initiative, 90nm Flip-chip Capability Added, and new design
offerings from ARM and Magma Design.
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Pro
Foundry Issue 15
(.pdf)
In this issue: "UMC delivers working 90nm
ICs to HBA," "Artisan and UMC develop 0.13um PCI Express
PHY core," "Selective Epitaxial Growth," "UMC
expands 300mm efforts," and contributed articles from Zydas
and Barcelona Design
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Pro
Foundry Issue 14
(.pdf)
Featuring: "UMC Delivering 90nm ICs,"
UMC Makes Forbes A-List," "Interview with the Chairman,"
and "0.18um RF Mixed Mode FDSs Avavilible."
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Pro
Foundry Issue 13
(.pdf)
Features: Striding Forward, a message from the
Chairman; Enhanced Customer Services; UMCi
Gearing Up For Production; UMC and Xilinx Reach 90nm Technology
Milestone; Ask UMC
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Pro
Foundry Issue 12
(.pdf)
Features: Oki Partners With UMC; Interconnect Process Variation
Challenges; Follow the Golden Rule Files; Fabless Business Model
Evolution
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Pro
Foundry Issue 11 (.pdf)
Features: Technology Forum Review, 2002 Forum: Technology Leadership,
and UMC customer and partner announcements |
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Pro
Foundry Issue 10 (.pdf)
Features: " UMC customer and partner announcements, Dr. C.T.
Lee joins UMC, and Technology Forum 2002. |
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Pro
Foundry Issue 9 (.pdf)
Features, "Letter from the Chairman," "COT Planning
Guide Excerpt," "UMC/Customer/Partner Announcements,"
"2002 Silicon Shuttle Schedule," "Contributed Article
from Numerical Technologies," "ASICplus Partner Profile:
Flextronics." |
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Pro
Foundry Issue 8 (.pdf)
All new color issue features: "Technology Forum 2001 Review,"
"Q&A with Peter Chang," "Customer Announcements,"
"300-mm Fab Update," "Contributed Article from Silicon
Metrics," "ASICplus Partner Profile: Faraday," "i-Designer." |
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Pro
Foundry Issue 7 (.pdf)
Special color issue features: "Leading the Move to 300-mm,"
"Singapore Fab Investment Q & A with Chris Chi," "
0.13um SOC Platform Available Now," "RFCMOS for High Speed
Wireless Applications," "Liquid Crystal on Silicon for Business
and Consumer Electronics," and "ASICplus Partner Profile:
Kawasaki." |
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Pro
Foundry Issue 6 (.pdf)
Features, "UMC Debuts on
Wallstreet," "NFI Forms Alliance with Sharp," "Virtual
Silicon 0.13um Libraries Available Now!" "'My UMC eService
Goes Online," "UMC adds ARM922T Core to gold IP Program,"
and "UMC Chipsizer Provides Online Die-Size Estimation."
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Pro
Foundry Issue 5 (.pdf)
Features, "UMC Produces Foundry Industry's First 0.13um IC", Virtual
Silicon 0.15um Libraries Available Now," "eService at UMC," "ASICplus
Extended Partner's Profile (Parthus)," and "Copper Q & A with
Xilinx."
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Pro
Foundry Issue 4 (.pdf)
Features, "Strategic Alliance for the Future," "UMC
Expands Market with ASICplus Program," and "UMC and Hitachi
Partner to Lead Shift to 12" (300mm) Wafers."
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Pro
Foundry Fall 99 (.pdf)
Features, "Consolidation Creates Industry Giant:Q&A With UMC's
Peter Chang," " Two New Fabs will Bring Annual Capacity to 2.4 Milion
Wafers in 2000."
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Features, "1999 USA Technology Workshop Draws Record
Attendance" and "'Visual Silicon' - Image Sensor and Microdisplay
Technology and UMC Design."
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Pro
Foundry Winter 98 (.pdf)
Feutures, "The Fourth Generation," "Artisan's 0.25 um UMC Libraries,"
"Mentor Graphics and UMC IP Partnership," and "ASIC/COT Conversion
and Embedded Memories."
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