| |
晶圓針測能力
在8吋與12吋晶圓針測上，聯電提供眾多先進測試模型以供選擇。不管您使用哪種不同的平台，我們都可以完全支援邏輯，混合信號和記憶體產品的功能測試，並且透過MyUMC
Online Portal就可以很迅速方便的獲得良率回報。
Test
Roadmap
|
Year
|
2004
|
2005
|
2006
|
|
Test System
|
Data rate
|
600MHz
|
1.6GHz
|
1.6GHz
|
|
Pin count (pin)
|
1024
|
1024
|
1024
|
|
Cantilever Probing
|
In-line
Pad
|
Pad Pitch (um)
|
40
|
35
|
35
|
|
Pad Opening (um2)
|
34*56
|
30*56
|
30*56
|
|
Stagger
pad
|
Pad Pitch (um)
|
28/56
|
25/56
|
25/50
|
|
Pad opening (um2)
|
34*56
|
30*56
|
30*56
|
|
Vertical Probing
|
Pad pitch(um)
|
90
|
90
|
80
|
Major
Wafer Sort Equipment
|
Vendor
|
Model
|
Speed(MHz)
|
Pin Count
|
Test capability
|
|
Credence
|
SC312
|
50
|
288
|
Logic
|
|
DUO
|
100
|
448
|
Mixed-Signal
|
|
Quartet
|
200
|
384
|
Mixed-Signal
|
|
Agilent
|
HP83000
|
330
|
384
|
Mixed-Signal
|
|
HP93000(C400E)
|
400
|
592
|
Mixed-Signal
|
|
HP93000(P600)
|
600
|
1024
|
Mixed-Signal
|
|
V1200
|
10
|
256
|
Memory
|
|
Teradyne
|
Catalyst
|
200
|
384
|
Mixed-Signal
|
|
J750*
|
100
|
512
|
Logic,
Memory
|
|
Advantest
|
T5371*
|
70
|
1664
|
Memory
|
|
T5335P*
|
30
|
650
|
Memory
|
|
