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Virtual Silicon Launches
Comprehensive Foundry Library Offering for UMC's 0.13 Micron
Technology
SUNNYVALE,
Calif. — October 16, 2000
—Virtual Silicon Technology, Inc., and United Microelectronic
Corporation (UMC) (NYSE:UMC), today announced a complete set
of eSilicon™ libraries for the all copper, low-k
dielectric, 0.13 micron SM
process jointly developed with IBM and Infineon. The eSilicon
family of embedded semiconductor components includes foundry-specific
standard cell libraries, multi-drive I/O pads, a broad selection
of memory compilers including single-port RAM, dual-port RAM,
ROM, and register files, and the continued expansion of Virtual
Silicon's mixed-signal strategy with high-speed I/O pads,
and Phase-Locked-Loop Compilers.
Most
of these components are licensed at no cost to qualified end
users. This comprehensive development program includes the
fabrication of several test chips using UMC's exclusive Silicon
Shuttle® prototyping service. The Silicon Shuttle is a
multi-wafer test chip program that reduces customer mask cost
for product prototyping. Customers using the Shuttle
can be assured of the best ESD and latchup reliability, the
most accurate timing model to silicon correlation, and the
highest quality of new embedded components.
"Early
access to a complete ASIC solution enables leading-edge customers
to get their designs into production before their competitors,"
said Taylor Scanlon, chief executive officer at Virtual Silicon
Technology. "This eSilicon product offering at 0.13
micron technology allows customers to hit the streets running
as the industry's most advanced process technology becomes
available."
"We
are seeing tremendous customer interest in our 0.13 micron
technology, which remains on schedule for pilot production
qualification at the end of this year," said Jim Ballingall,
vice president of marketing for UMC. "Our 0.13 micron technology
rollout strategy requires the early availability of critical
design components. Virtual Silicon has an excellent
track record with UMC and has already developed quality library
products for our 0.18 micron and 0.15 micron technologies.
Our relationship with Virtual Silicon has helped our customers
capitalize on our industry lead in the delivery of advanced
process technology."
Availability
The UMC 0.13 micron e Si-Route/8™
high-density standard cell library and the eSi-Pads™
I/O pad set will be available in Q4 2000. Memory and PLL compilers
will become available during Q1 of 2001. Systems-on-chip companies
seeking information of the performance and density of UMC's
0.13-micron process should contact UMC.
Note
From UMC Concerning Forward-Looking Statements
Some of the statements in the foregoing
announcement are forward looking within the meaning of the
U.S. Federal Securities laws, including statements about future
outsourcing, wafer capacity, technologies, business relationships
and market conditions. Investors are cautioned that
actual events and results could differ materially from these
statements as a result of a variety of factors, including
conditions in the overall semiconductor market and economy;
acceptance and demand for products from UMC; and technological
and development risks.
About Virtual Silicon Technology
Virtual
Silicon Technology is a leading supplier of embedded semiconductor
technology to manufacturers and designers of complex systems-on-chip.
The company provides process-specific embedded components
including standard cell libraries, I/Os, SRAM compilers, mixed-signal
functions, PLL compilers and embedded flash/EEPROM solutions.
Customers include leading semiconductor manufacturers and
foundries, ASSP designers, and systems-on-chip developers
who demand the highest quality, maximum performance, lowest
power and optimum densities for their semiconductor innovations.
For more information on Virtual Silicon Technology and its
products, please direct customer inquiries to Mahesh
Tirupattur
at (408) 548-2726, email address: or go to www.virtual-silicon.com
.
eSilicon, eSi-Route/8, eSi-Pad, eSi-RAM,
eSi-ROM, eSi-PLL, The Heart of Great Silicon,
Silicon Ready, IP Ambassador, Design Service Ambassador, and
Virtual Silicon are trademarks of Virtual Silicon Technology,
Inc. Gold IP and Silicon Shuttle are service marks of UMC.
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