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AMCC
Selects UMC's 0.13-Micron Technology for the Development of Next-Generation
Optical Networking Silicon
SUNNYVALE, Calif., July 9, 2001--UMC
(NSYE: UMC), a world-leading semiconductor foundry, and Applied
Micro Circuits Corp. (AMCC) [NASDAQ: AMCC], today announced that
AMCC has selected UMC for the 0.13-micron production of next-generation
optical networking silicon. UMC's 0.13-micron technology enables
complete OC-192 SONET/SDH and 10 Gigabit Ethernet solutions from
the physical layer to the switch fabric, offering a platform with
"no compromises" to realize multiple specialized functions
such as high-speed, mixed-signal interfaces and the world's most
advanced network processors.
"With this
announcement, AMCC is further demonstrating its leadership role
in bringing the most advanced semiconductor technologies to market
in the high-bandwidth communications arena," said Brent Little,
senior vice president of marketing for AMCC. "To address our
customers' demands for higher levels of integration, lower cost
and lower-power solutions without performance degradation or time-to-market
penalties, we chose to partner with UMC. This foundry provides world-class
semiconductor technology at 0.13-micron, with full-featured mixed-signal
capabilities, copper and low-K dielectric enabling us to reduce
wire delays and power consumption. UMC's continued customer support
and short cycle times are key reasons why we have recently awarded
UMC our 'Engineering Ownership' award."
AMCC is utilizing
UMC's 0.13-micron CMOS technology with full mixed-signal options,
including MiM capacitors, triple well isolation, and low Vt transistors.
Jim Ballingall, vice president of worldwide marketing at UMC noted,
"AMCC is a leader in optical network solutions and a highly
strategic customer for us, and therefore demands leading-edge technology
and excellent customer support and cycle times. UMC is committed
to continuing to deliver products based on the 0.13-micron process
technology to market as soon as possible, thereby meeting the requirements
of today's leading communications developers. For example, we provide
mixed-signal technology that is built upon the foundry industy's
fastest logic transistor, such that it can replace the 10Gb/s mixed-signal
interfaces that are usually dominated by SiGe BiCMOS. Similarly,
our embedded SRAM and DRAM technologies are built upon this same
high-speed transistor, enabling a true SOC platform."
AMCC will be
sampling its first 0.13-micron CMOS silicon solutions this quarter.
About
AMCC
AMCC designs, develops, manufactures, and markets high-performance,
high-bandwidth silicon solutions for the world's optical networks.
AMCC utilizes a combination of high-frequency analog, mixed-signal
and digital design expertise coupled with system-level knowledge
and multiple silicon process technologies to offer integrated circuit
products that enable the transport of voice and data over fiber
optic networks. The company's system solution portfolio includes
PMD, PHY, framer/mapper, network processor, traffic management and
switch fabric devices that address the high-performance needs of
the evolving intelligent optical network. AMCC's corporate headquarters
and wafer fabrication facilities are located in San Diego, California.
Sales and engineering offices are located throughout the world.
AMCC
Forward Looking Statements
The statements contained
in this press release that are not purely historical are forward-looking
statements within the meaning of Section 27A of the Securities Act
of 1933 and Section 21E of the Securities Exchange Act of 1934.
Such forward-looking statements, including statements relating to
AMCC's products or UMC's process technologies, the relationship
with UMC, and anticipated sales resulting from the relationship,
are subject to a number of risks and uncertainties, including the
risk that the relationship would not result in expected sales, that
the products or process technologies would not be successfully or
timely developed or achieve market acceptance, as well as the risks
associated with general economic conditions and other risks and
uncertainties set forth in the Company's Annual Report on Form 10-K
for the year ended March 31, 2001, the Company's recent 10-Q filing,
and in other filings of the Company with the Securities and Exchange
Commission. As a result of these risks and uncertainties, actual
results may differ materially from these forward-looking statements.
The forward-looking statements contained in this news release are
made as of the date hereof and AMCC does not assume any obligation
to update any forward-looking statement.
Note
From UMC Concerning Forward-Looking Statements
Some of the statements in the foregoing
announcement are forward looking within the meaning of the U.S.
Federal Securities laws, including statements about future outsourcing,
wafer capacity, technologies, business relationships and market
conditions. Investors are cautioned that actual events and results
could differ materially from these statements as a result of a variety
of factors, including conditions in the overall semiconductor market
and economy; acceptance and demand for products from UMC; and technological
and development risks.
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