聯華電子與美商Clear
Shape公司合作推出DFM驅動設計流程
此項設計流程專注處理系統變異影響以及激變與參數問題
聯華電子今日(27日)與變異分析及最佳化解決方案的領導者美商Clear Shape公司共同宣佈，雙方經過18個月的合作，推出DFM（可製造性導向設計）IC設計流程。這項流程能讓設計公司快速且精確地控制設計參數與良率上的系統變異，並使之最佳化。
透過使用Clear Shape公司的旗鑑產品－快速全晶片設計可製造性檢測器InShapeTM與快速全晶片參數異變分析與最佳化工具OutPerformTM，這項DFM驅動奈米IC設計流程能讓設計公司執行良率與參數熱點偵測與修復。這些工具與聯華電子之加密DFM數據技術檔案相結合，便能產生快速、精確、以模型為基礎的分析與最佳化方案。
“Clear Shape公司的InShape設計可製造性檢測器、OutPerform電子DFM分析以及最佳化產品，是針對我們當前65奈米設計的綜合性DFM良率最佳化方案中，令人欣喜的新成員，”聯華電子系統架構設計部門系統單晶片設計總工程師林子聲表示。“我們與最佳的DFM供應商合作，提供矽智財、SPICE模型與設計流程，讓使用者從設計到製造階段，都能獲得良率提昇的知識。”
聯華電子與Clear Shape公司的合作呈現了非常精確的成果－因為速度夠快，所以能夠應用在佈局繞線上。這項解決方案預計在今年年底前提供給聯華電子的客戶使用。
“Clear Shape公司與聯華電子一直緊密合作，設法應付IC設計上系統變異帶來的不確定性，”
Clear Shape公司總裁與執行長Atul Sharan表示，“與聯華電子合作研發閉式迴路電子DFM解決方案，是我們的榮幸，透過聯華電子的製造資訊，無晶圓廠半導體公司便能快速、精確且以模型為基礎的方式，預測並且應付潛在的參數與良率問題。”
About InShape
and OutPerform
InShapeTM is the first model-based full-chip Design Manufacturability
Checker which allows designers to improve yield during physical design
implementation by quickly and accurately accounting for systematic manufacturing
variations. InShape provides designers with DFM hotspot detection and
enables repair based on fast, silicon-accurate contour shape prediction
across the process window.
OutPerformTM
is the first electrical DFM analysis and optimization product to control
and optimize the impact of systematic variability on designers' chip
parameters using fab manufacturing data, capturing the effects of RET,
OPC, CMP, mask, etch and lithography on both device and interconnect.
OutPerform takes in designers' physical design and timing data, along
with encrypted fab technology files and critical dimension (CD) data
from silicon contour shapes predicted by InShape across the process
window, and automatically produces a DFM electrical hotspot report for
timing and leakage power. OutPerform also creates optimization directives
for timing that can be input to the designers' place and route or layout
tool.
About Clear
Shape
Clear Shape Technologies, Inc. is focused on delivering a complete Variability
Platform that allows designers to control and optimize the parametric
and catastrophic impact of systematic manufacturing variations. Clear
Shape's products are based on patent-pending technologies enabling designers
to efficiently achieve entitled performance and yield. Clear Shape's
flagship product InShapeTM is in the DFM qualification program
of all the major pure-play foundries and has been silicon-correlated
at several IDMs. OutPerform, industry's first eDFM product has also
been silicon validated. Clear Shape is backed by top-tier venture investors
that include USVP, Intel Capital and KT Ventures (KLA Tencor). The company
is headquartered at 3255-3 Scott Blvd, Suite 102 Santa Clara, Calif.
95054. For more information, visit www.clearshape.com
or call +1 (408) 833-7130.
InShape and OutPerform
are trademarks of Clear Shape. All other legal marks are the property
of UMC.
Note From UMC Concerning Forward-Looking
Statements
Some of the statements in the foregoing announcement are forward looking
within the meaning of the U.S. Federal Securities laws, including statements
about future outsourcing, wafer capacity, technologies, business relationships
and market conditions. Investors are cautioned that actual events and
results could differ materially from these statements as a result of
a variety of factors, including conditions in the overall semiconductor
market and economy; acceptance and demand for products from UMC; and
technological and development risks.
