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高階通訊應用再下一城,智原與聯電合作產出40奈米三億邏輯閘SoC

結合先進製程技術與ASIC專業設計服務,大幅減少客戶資源投入、降低開發風險

 

聯華電子與ASIC設計服務領導廠商智原科技今日(22日)共同宣佈,雙方因應客戶需求,已經完成並交付3億邏輯閘(300-million gate count)系統單晶片解決方案。此款高複雜度SoC的產出,主要奠基於雙方豐富的設計、生產經驗、先進的製程技術,以及長期合作默契。同時,此合作過程與產出,也為客戶大幅地降低了開發風險、減少其需要投入的龐大人力、物力等設計資源,並縮短其產品上市時程。

此款3億邏輯閘SoC是採用聯華電子40奈米製程。SRAM容量高達100MB,可為高階通訊產品提供優異的網路頻寬,滿足高速而穩定的傳輸需求,以因應新一代通訊產品需求。相較於USB 3.0控制器晶片一般約為1,200萬邏輯閘,此高階通訊方案,不但在邏輯閘數量上顯示其高複雜與高難度,且由於其中整合了超過100種以上不同功能的IP設計,其挑戰性更不是一般設計服務同業可以克服的。

智原科技ASIC事業副總經理鄭弘屏表示,「一般來說,開發複雜度這麼高的晶片,需投入大量的研發資源與時間。智原擁有長期開發IP的技術能力與經驗、豐富的IP資料庫、高效率的SoC開發平台,及對製程的充分掌握與熟悉,所以得以透過和聯電、客戶等共同緊密的合作,在客戶要求的時程內交付解決方案。同時,我們對於這款晶片的市場性,以及未來的大量量產,有高度信心。」

聯華電子先進技術開發處副總經理簡山傑表示,「此次聯華電子與SoC設計能力經市場認可的設計服務夥伴攜手,順利產出3億邏輯閘晶片,充分證明客戶將可受惠於聯華電子與智原科技的合作,實現其高複雜SoC的需求。3億邏輯閘的SoC規模將近一般晶片的四倍,可見其複雜度之高,以及所需整合的IP種類之多。聯華電子累積了30多年的半導體產業經驗與技術,能夠協助客戶快速地產出這個晶片,也再次證實我們世界級的生產技術與先進製程的實力。」

智原科技
智原科技(Faraday Technology Corporation, TWSE: 3035)為ASIC設計服務暨IP研發銷售領導廠商。智原科技總公司位於新竹科學園區,並於美國、日本、歐洲與中國大陸設有研發、行銷據點。智原科技主要提供矽智財元件(Silicon IP)、客戶訂製特殊應用積體電路(ASIC)及ASIC設計方案等服務項目。重要的IP產品包括:I/O、Cell Library、 Memory Compiler、ARM-compliant CPUs、DDRI/II/III、MPEG4、H.264、USB2.0/3.0、10/100 Ethernet、Serial ATA、以及PCI Express等數百個週邊數位及混合訊號IP。關於智原提供之設計方案與矽智財IP產品,請參閱智原科技網站:www.faraday-tech.com

聯華電子
UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry that provides advanced technology and manufacturing for applications spanning every major sector of the IC industry. UMC's customer-driven foundry solutions allow chip designers to leverage the company's leading-edge processes, which include 28nm poly-SiON and gate-last High-K/Metal Gate technology, mixed signal/RFCMOS, and a wide range of specialty technologies. Production is supported through 10 wafer manufacturing facilities that include two advanced 300mm fabs; Fab 12A in Taiwan and Singapore-based Fab 12i. Fab 12A consists of Phases 1-4 which are in production for customer products down to 28nm. Construction is underway for Phases 5&6, with future plans for Phases 7&8. The company employs over 13,000 people worldwide and has offices in Taiwan, Japan, Singapore, Europe, and the United States. UMC can be found on the web at http://www.umc.com.

Note From UMC Concerning Forward-Looking Statements
Some of the statements in the foregoing announcement are forward looking within the meaning of the U.S. Federal Securities laws, including statements about future outsourcing, wafer capacity, technologies, business relationships and market conditions. Investors are cautioned that actual events and results could differ materially from these statements as a result of a variety of factors, including conditions in the overall semiconductor market and economy; acceptance and demand for products from UMC; and technological and development risks. Further information concerning these risks is included in UMC's filings with the U.S. SEC, including on Form F-1, F-3, F-6 and 20-F, each as amended.



 

 

媒體聯絡人:
金百佳 (Judy Jin)
(02)2658 9168 ext. 16902
judy_jin@umc.com



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