Taipei, Taiwan, R.O.C. –March 13, 2013 - United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) ("UMC"), at a meeting of the Board of Directors held today, approved the 2012 Business Report and Financial Statements, and set the agenda for the Annual General Meeting. A brief summary of major recognition and discussion items is as follows:

• The 2012 Business Report and Financial Statements. The Company's revenue for 2012 was NT$105,998 million and net income after tax was NT$7,819 million, with earnings per share of NT$0.62.
• Shareholder cash dividend of NT$5,061 million, at approximately NT$0.4 per share.
• Employee cash bonus of NT$1,040 million.

Other major resolutions of today's Board Meeting:

• Approved a plan to repurchase 200,000,000 shares from the open market, at prices between NT$9.85 to NT$21.30 per share, for cancellation. The ratio of the shares repurchased to the total issued shares of the Company will be 1.58%.
• The Company plans to repurchase 200,000,000 shares from the open market, with the price between NT$7.80 to NT$16.90 per share, for the purpose of transferring to employees. The ratio of the shares repurchased to the total issued shares of the Company is 1.54%.
• Approved the renewal of a private placement issuance plan, for common shares, ADR/GDR or CB/ECB, including Secured or Unsecured Corporate Bonds. The amount of shares issued or convertible is proposed to be no more than 10% of registered capital.
• The 2013 Annual General Meeting will be held at 9:00 AM on Tuesday, June 11, 2013 at UMC’s Fab 8S Conference Hall, located at No.16, Creation Rd. 1, Hsinchu Science Park.

UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry that provides advanced technology and manufacturing for applications spanning every major sector of the IC industry. UMC's robust foundry solutions allow chip designers to leverage the company's leading-edge processes, which include 28nm poly-SiON and gate-last High-K/Metal Gate technology, mixed signal/RFCMOS, and a wide range of specialty technologies. Production is supported through 10 wafer manufacturing facilities that include two advanced 300mm fabs; Fab 12A in Taiwan and Singapore-based Fab 12i. Fab 12A consists of Phases 1-4 which are in production for customer products down to 28nm. Construction is underway for Phases 5&6, with future plans for Phases 7&8. The company employs over 13,000 people worldwide and has offices in Taiwan, Japan, China, Singapore, Europe, and the United States. UMC can be found on the web at http://www.umc.com.

Note From UMC Concerning Forward-Looking Statements
Some of the statements in the foregoing announcement are forward looking within the meaning of the U.S. Federal Securities laws, including, e.g., statements about expectations, strategy, projections, and future performance, outsourcing, wafer capacity, technologies, business relationships and market conditions. Investors are cautioned that actual events and results could differ materially from these statements as a result of a variety of factors, including conditions in the overall semiconductor market and economy; acceptance and demand for products from UMC; and technological and development risks. Further information concerning these risks is included in UMC's filings with the U.S. SEC, including on Form F-1, F-3, F-6 and 20-F, each as amended.