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1999 UMC Press Releases

 
12/27/99 Hitachi and UMC to Establish 300mm Wafer
Semiconductor Joint Venture
11/29/99 Pivotal Technologies and UMC Group Align to Address Communications and Multimedia SOC Designs.
11/12/99 SanDisk Uses UMC Group To Help Develop And
Manufacture Its Double Capacity Flash Menory Products And Chipsets.
11/09/99 UMC Group Announces Admission into the Semiconductor Research Corporation
10/18/99 UMC Group and Xilinx Deliver First Pure 0.18 Micron FPGA Process
10/13/99 UMC Group Announces Equipment Installation at
Newest 8-inch Fab
10/11/99 Virtual Silicon Announces 0.15-micron Library Agreement with UMC Group
10/01/99 UMC Group Returns to Full Production
09/28/99 ITC Rejects OAK Technology's Claim of Unfair
Competition by UMC
09/28/99 Production Ramp Continues. UMC and UTEK Damage Estimate
09/27/99 Return to Production for 90% of Fab Equipment
09/23/99 UMC Group Donates NT$300 Million for Disaster Relief.
09/22/99 Initial Inspection Shows No Apparent Damage To Fabs After Earthquake
08/05/99 UMC Group Relocates U.S. Headquarters
07/15/99 UMC Group Announces Appointment of Peter Chang
as CEO of Foundry Operations
06/14/99 UMC Group Announces Consolidation of Joint Ventures and Acceleration of Foundry Capacity Expansion.
04/12/99 UMC Group's Gold Logic Copper Interconnect Technology Reaches Next Phase of Development
03/15/99 UMC Group and Kawasaki LSI Establish Alliance for
0.18-micron Production Capacity
03/02/99 UMC Group Names Edward Wan Vice President of Engineering
02/24/99 UMC Group Announces 1999 Technology Workshop
01/07/99 UMC Group and Nexflash TM Sign Agreement For 0.25m and 0.35m Embedded Flash Technologies
01/25/99 UMC Group Rolls Out 0.18-micron Foundry Services
01/18/99 UMC Foundry Services Available To Rambus Chip Customers