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UMC Completes Consolidation
of Joint Ventures
Company
Strengthens Position as a World Leader in Foundry Services- New
Corporate Structure Already in Place
SUNNYVALE, Calif. and TAIPEI, Taiwan, January 10, 2000—UMC
announced today that the consolidation of its Taiwan-based joint
venture companies is complete. United Microelectronics Corporation
(UMC), United Integrated Circuits Corporation (UICC), United Silicon
Incorporated (USIC), United Semiconductor Corporation (USC) and
UTEK Semiconductor Corporation (UTEK) [2337/TW] are now merged into
one publicly-traded entity, United Microelectronics Corporation
(UMC) [2303/TW]. Sales operations will change their name to
UMC from UMC GROUP signifying the consolidation. The UMC affiliated
company in Japan, NFI (Nippon Foundry Inc.), will operate within
the new organizational structure of UMC, but will not be financially
consolidated.
Peter Chang,
CEO of Foundry Operations, will be responsible for overseeing all
day-to-day management and operations of the company. Peter Chang
noted, "We have been preparing for this day for the last six months,
and have essentially completed our organizational restructuring.
Our customers have already started to enjoy the benefits of this
merger. These benefits include a better service interface for customers
with production at multiple UMC fabs, better synergies in our technology
development efforts, faster process deployment between fabs, as
well as across-the-board improvements in efficiency. We are sure
that this consolidation will prove a winning strategy for our customers
and shareholders."
Jim
Kupec, now in charge of Worldwide Marketing and Sales and President
of UMC (USA) said, "We have received
overwhelmingly positive feedback from our customers around the world.
Under the new corporate structure, we offer a single interface to
customers in all of the UMC fabs. This will offer immediate benefits
to critical services such as our internet-enabled customer support
systems. The new UMC structure will allow us to further strengthen
our market position, making us even more competitive in the key areas
of technology leadership, service quality, capacity growth and cost-efficiency."
In 2000, the consolidated UMC is expected to have capacity to produce
2.4 million wafers and expects capital expenditures of $2.4 billion.
Two new 8-inch fabs will be ramping production in the first quarter,
solidifying UMC's position as the world's leading foundry supplier
of 8-inch wafer capacity.
To signify the consolidation, the company has launched a new logo.
In addition, all UMC fabs have been renamed to reflect the single
corporate structure. Under the new naming system, each fab name
begins with a number indicating the wafer size it produces (5,6,8,
or 12-inch). A letter that indicates the order in which the fab
was constructed follows this number; for example, Fab 8B is an 8-inch
fab and is the second 8-inch fab built by UMC.
Name of UMC Fabs:
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Fab 5A ( formerly UTEK1)
Clean Room Level: Class 10
Process: 1.2um - 0.7um
Design Capacity: 35,000 wafers/month
Location: Hsin-Chu
Wafer Size: 5"
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Fab 6A (formerly UMC2)
Clean Room Level: 0.1um/Class 10
Process: 0.8um - 0.5um
Design Capacity: 48,000 wafers/month
Location: Hsin-Chu
Wafer Size: 6"
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Fab 8A (formerly UMC3)
|Clean Room Level: 0.1um/Class 0.1
Process: 0.5um - 0.25um
Design Capacity: 35,000 wafers/month
Location: Hsin-Chu
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Fab 8B (formerly USC1)
Clean Room Level: 0.1um/Class0.1
Process: 0.35um-0.18um
Design Capacity: 35,000 wafers/month
Location: Hsin-Chu
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Fab 8C (formerly USIC)
Clean Room Level: 0.1um/Class0.1
Process: 0.25um-0.15um
Design Capacity: 30,000 wafers/month
Location: Hsin-Chu
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Fab 8D (formerly USC2)
Clean Room Level: 0.1um/Class0.1
Process: 0.13um
Design Capacity: 35,000 wafers/month
Location: Hsin-Chu
Production start: Q1 '00
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Fab 8E (formerly UTEK2)
Clean Room Level: 0.1um/Class0.1
Process: 0.5um - 0.25um
Design Capacity: 45,000 wafers/month
Location: Hsin-Chu
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Fab 8F (formerly UMC 5)
Clean Room Level: 0.1um/Class0.1
Process: 0.13um
Design Capacity: 40,000 wafers/month
Location: Hsin-Chu
Production start: Q1 '00
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Fab 12A (formerly 2 inch
fab)
Design Capacity: 30,000 wafers/month
Location: Tainan
Construction Complete: Q4 '00
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NFI (a
UMC joint venture)
Design Capacity:
25,000 wafers/month
Location: Japan
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Editorial Contacts:
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Eileen Elam
KJ Communications
(650) 917-1488
KjcomE@cs.com
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Alex Hinnawi
UMC
(886) 2-2700-6999 ext. 6958
Alex_Hinnawi@umc.com
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