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UMC
PRODUCES FOUNDRY INDUSTRY'S FIRST 0.13-MICRON ICs
Verifies its 0.13-micron technology with fully
functional 2MB SRAM incorporating 0.10-micron gate length
devices and full copper interconnect technology
SANTA
CLARA, May 12, 2000--At its annual technology forum today,
UMC announced it has successfully produced fully functional
2MB SRAM chips using its WorldlogicTM 0.13-micron logic technology.
The state-of-art SRAM chips were taped-out during the first
quarter of the year and were verified with natural good die
yield on May 2. This milestone makes UMC the first foundry
to deliver what is considered the semiconductor industry's
most advanced technology. These chips feature full copper
interconnect technology, 0.10 micron gate length devices,
and the world's smallest SRAM bitcell (6T) at 2.28um2. UMC
expects to enter pilot production for its 0.13 micron technology
before the end of the year.
"This
milestone puts UMC on the map as the frontrunner with the
introduction of advanced logic production technologies. We
have produced fully functional SRAM chips with natural good
die yield almost a full year ahead of the roadmaps of the
majority of other semiconductor industry leaders. This is
a clear sign that UMC has created one of the premier technology
development teams in the world," said Dr. Fu Tai Liou, chief
technical officer of UMC.
In
recent years, UMC has led the foundry industry with the introduction
of 0.25-, 0.22-, 0.18-, and 0.15-micron logic technologies.
UMC's ability to consistently lead its competition with the
introduction and ramp up of leading-edge technologies has
enabled its customers to maintain performance and price advantages
in a wide range of markets.
"Technology
leadership is an important service that we offer our customers.
Only through our commitment to long-term technology leadership
can we guarantee our customers' competitive advantages. This
is the nature of the foundry industry. Our customers' success
and our own success are inseparable," said Jim Kupec, senior
vice president of worldwide marketing and sales, UMC (USA).
NOTE
CONCERNING FORWARD-LOOKING STATEMENTS
Some of the statements in the foregoing announcement are forward
looking within the meaning of the U.S. Federal Securities
laws, including statements about future outsourcing, wafer
capacity, technologies, business relationships and market
conditions. Investors are cautioned that actual events
and results could differ materially from these statements
as a result of a variety of factors, including conditions
in the overall semiconductor market and economy; acceptance
and demand for products from UMC; and technological and development
risks.
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