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AMCC Selects UMC's
0.13-Micron Technology for the Development of Next-Generation Optical
Networking Silicon
SUNNYVALE, Calif., July 9, 2001--UMC
(NSYE: UMC), a world-leading semiconductor foundry, and Applied
Micro Circuits Corp. (AMCC) [NASDAQ: AMCC], today announced that
AMCC has selected UMC for the 0.13-micron production of next-generation
optical networking silicon. UMC's 0.13-micron technology enables
complete OC-192 SONET/SDH and 10 Gigabit Ethernet solutions from
the physical layer to the switch fabric, offering a platform with
"no compromises" to realize multiple specialized functions
such as high-speed, mixed-signal interfaces and the world's most
advanced network processors.
"With this announcement, AMCC is further
demonstrating its leadership role in bringing the most advanced
semiconductor technologies to market in the high-bandwidth communications
arena," said Brent Little, senior vice president of marketing
for AMCC. "To address our customers' demands for higher levels
of integration, lower cost and lower-power solutions without performance
degradation or time-to-market penalties, we chose to partner with
UMC. This foundry provides world-class semiconductor technology
at 0.13-micron, with full-featured mixed-signal capabilities, copper
and low-K dielectric enabling us to reduce wire delays and power
consumption. UMC's continued customer support and short cycle times
are key reasons why we have recently awarded UMC our 'Engineering
Ownership' award."
AMCC is utilizing UMC's 0.13-micron CMOS technology
with full mixed-signal options, including MiM capacitors, triple
well isolation, and low Vt transistors. Jim Ballingall, vice president
of worldwide marketing at UMC noted, "AMCC is a leader in optical
network solutions and a highly strategic customer for us, and therefore
demands leading-edge technology and excellent customer support and
cycle times. UMC is committed to continuing to deliver products
based on the 0.13-micron process technology to market as soon as
possible, thereby meeting the requirements of today's leading communications
developers. For example, we provide mixed-signal technology that
is built upon the foundry industy's fastest logic transistor, such
that it can replace the 10Gb/s mixed-signal interfaces that are
usually dominated by SiGe BiCMOS. Similarly, our embedded SRAM and
DRAM technologies are built upon this same high-speed transistor,
enabling a true SOC platform."
AMCC will be sampling its first 0.13-micron CMOS
silicon solutions this quarter.
About AMCC
AMCC designs, develops, manufactures, and markets high-performance,
high-bandwidth silicon solutions for the world's optical networks.
AMCC utilizes a combination of high-frequency analog, mixed-signal
and digital design expertise coupled with system-level knowledge
and multiple silicon process technologies to offer integrated circuit
products that enable the transport of voice and data over fiber
optic networks. The company's system solution portfolio includes
PMD, PHY, framer/mapper, network processor, traffic management and
switch fabric devices that address the high-performance needs of
the evolving intelligent optical network. AMCC's corporate headquarters
and wafer fabrication facilities are located in San Diego, California.
Sales and engineering offices are located throughout the world.
AMCC
Forward Looking Statements
The statements contained in this press release that are not purely
historical are forward-looking statements within the meaning of
Section 27A of the Securities Act of 1933 and Section 21E of the
Securities Exchange Act of 1934. Such forward-looking statements,
including statements relating to AMCC's products or UMC's process
technologies, the relationship with UMC, and anticipated sales resulting
from the relationship, are subject to a number of risks and uncertainties,
including the risk that the relationship would not result in expected
sales, that the products or process technologies would not be successfully
or timely developed or achieve market acceptance, as well as the
risks associated with general economic conditions and other risks
and uncertainties set forth in the Company's Annual Report on Form
10-K for the year ended March 31, 2001, the Company's recent 10-Q
filing, and in other filings of the Company with the Securities
and Exchange Commission. As a result of these risks and uncertainties,
actual results may differ materially from these forward-looking
statements. The forward-looking statements contained in this news
release are made as of the date hereof and AMCC does not assume
any obligation to update any forward-looking statement.
Note
From UMC Concerning Forward-Looking Statements
Some of the statements in the foregoing
announcement are forward looking within the meaning of the U.S.
Federal Securities laws, including statements about future outsourcing,
wafer capacity, technologies, business relationships and market
conditions. Investors are cautioned that actual events and results
could differ materially from these statements as a result of a variety
of factors, including conditions in the overall semiconductor market
and economy; acceptance and demand for products from UMC; and technological
and development risks.
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