Breakthrough IC Manufactured on UMC's 0s15 Micron CMOS Process

HSINCHU, TAIWAN, and OCALA, FLA - July 24, 2002 - UMC, a world leading semiconductor foundry (NYSE: UMC) and Intellon Corporation, the world leader in powerline networking, today announced the availability of the INT51X1, Intellon's next-generation HomePlug 1.0 powerline communications integrated circuit, which is being manufactured on UMC's 0.15um CMOS process technology. The new single-chip solution utilizes numerous IP resources (including those from UMC) to integrate USB 1.1, Ethernet and MII interfaces and the ADC, DAC and AGC controller directly on the device for a true system-on-chip (SOC) design.

Charles E. Harris, president and chief executive officer of Intellon, said, "UMC was very helpful in the successful tapeout of the INT51X1, which uses UMC's leading 0.15um 1.5/3.3 volt logic 1P7M (1 poly, 7 layer metal) process technology. UMC offered an excellent support team that enabled us to migrate our designs to its process technology."

"UMC's technology is enabling many new breakthrough applications, including those emerging in today's rapidly expanding networking sector," said Fu Tai Liou, chief officer of worldwide sales and marketing for UMC. "We are enthusiastic that our efforts have led to our customer's success: Intellon's next-generation INT51X1, a highly competitive powerline networking solution."

The INT51X1 provides the communications technology to network diverse consumer and business products over existing powerlines at speeds up to 14Mbps. The INT51X1 also allows users to share Internet access and connect computers and other devices by simply plugging into power outlets throughout a home or small office. The INT51X1 can be used in a wide range of settings, including residential (in-home), commercial (offices, apartments, hotels, warehouses), transportation and defense applications.

Samples of Intellon's INT51X1 single-chip powerline solution are available now. UMC is working with Intellon on fully qualified production volumes that can also be ordered from Intellon now for delivery in September. The INT51X1 is accompanied by a complete suite of reference designs that provide manufacturers with all of the hardware, software and manufacturing collateral necessary to begin immediate production of retail products.

About Intellon
Intellon is the leader in high-speed powerline connectivity, allowing consumers to share Internet connections, stream digital audio and video, and network devices using existing power outlets. Intellon's PowerPacket technology, selected by the HomePlug Powerline Alliance as the basis for its industry specification 1.0 following a 500-home test, is built on more than 11 years of experience working in the powerline environment. Intellon is a founding sponsor and member of the board of directors of the HomePlug Powerline Alliance.

Intellon's powerline networking technology is already available in retail channels from such leading home networking companies as Linksys, Netgear, Phonex and Asoka. Numerous consumer electronics manufacturers are working with Intellon to develop a wide variety of HomePlug-compliant devices, including Internet gateways, PC adapters and routers, cable modems and entertainment and security systems.

Intellon's intellectual property is protected by a significant patent portfolio. The company's investors include industry leaders Motorola, SONICblue, Compaq Computer Corporation and Philips Electronics, as well as venture firms like Fidelity Investors, TL Ventures and Enertech and the venture arms of HydroQuebec, Exelon and Duchossois Industries. News from Intellon is available at www.intellon.com.

Note Concerning Forward-Looking Statements
Some of the statements in the foregoing announcement are forward looking within the meaning of the U.S. Federal Securities laws, including statements about future outsourcing, wafer capacity, technologies, business relationships and market conditions. Investors are cautioned hat actual events and results could differ materially from these statements as a result of a variety of factors, including conditions in the overall semiconductor market and economy, acceptance and demands for products, and technological and development risks.

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