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Chipidea's USB 2.0 OTG High
Speed IP Core Silicon Proven on UMC's 0.13um Technology
Core is based on the new USB On-The-Go
standard for portable consumer devices and is ready for design-in
at UMC
MAIA, Portugal, and HSINCHU, Taiwan, April 20, 2004 –
Chipidea Microelectrónica, SA (Chipidea), an analog and mixed-signal
semiconductor IP provider and world leader in high speed USB2.0
On-The-Go (OTG), and UMC (NYSE: UMC), a world leading semiconductor
foundry, today announced that Chipidea's CI12323ul USB High Speed
OTG Physical Interface (PHY) IP core has achieved silicon verified
"Silver" status in UMC's Gold IP program for 0.13um process
technologies and is ready for design-in. The core targets customers
designing chips for portable applications such as mobile phones
and PDAs, allowing these devices to directly connect with each other.
"Targeting the new CI12323ul USB OTG core to UMC's 0.13um process
technology demonstrates Chipidea's commitment toward developing
IP cores for wide distribution, and is a natural step that will
give our customers a competitive edge in terms of area and performance,"
said Milton Sousa, business development manager of Chipidea's IP
Connectivity Solutions Business Line. "Prior to this latest
effort, we have achieved high-speed certification of our USB OTG
High Speed core (CI12295ug) on UMC's 0.18um process. This IP was
further used to develop an Integrated Circuit (IC) with a USB Low
Pin Interface (ULPI)--samples from Chipidea are slated for availability
in July."
The CI12323ul is a USB OTG High Speed PHY IP that supports UTMI+
and can be used in host, device or dual-role applications. The deliverables
package of the CI12323ul includes all backend views (GDSII, place
and route abstracts and timing information), as well as a simulation
model with a quick start testbench and extensive documentation covering
the specification, testability, assembly and production guidelines
and a detailed silicon characterization report. With a total core
area of 0.9mm2 and max current consumption in high speed
transmit mode of 47mA, this IP provides a cost-effective solution
with high performance and high-power efficiency, key elements for
portable applications.
Ken Liou, director of the Design Support Division at UMC, stated,
"UMC understands and continues to address the needs of our
customers designing for the portable consumer market. Designers
of analog & mixed signal chips using UMC's proven, mainstream
0.13um technology platform will welcome the availability of Chipidea's
USB 2.0 IP core through our Gold IP program. We value our IP partnership
with Chipidea, and look forward to continuing our productive relationship."
About USB On-The-Go
USB OTG (On-The-Go), (announced in February 2004, see http://www.chipidea.com/website_45c/index.html),
is a supplement to the USB 2.0 specification, brings the additional
feature of allowing portable devices to act as a limited host and
exchange data directly with each other without requiring a PC to
act as the host. It is estimated that more than 1.4 billion products
are designed with USB ports, making USB the predominant I/O connectivity
standard in the market. USB On-The-Go (OTG) enhances the USB specification
by allowing point-to-point communication between devices. As devices
like mobile phones and PDAs gain in popularity and intelligence,
the requirement for a direct connection to each other is also growing.
The answer to this requirement is the standard called USB On-The-Go.
For more information on the USB2.0 OTG core and other products of
Chipidea please consult the web site at www.chipidea.com.
About UMC's Gold IP Program
UMC's Gold IP program provides customers with an industry leading
selection of IP resources through collaboration with worldwide IP
vendors to establish a solution-based IP pool. This vast offering
of compatible IP elements is optimized for cost, portability, and
reusability for easy incorporation into an SOC in a plug and play
fashion. The results are then coded online at UMC's IP Master system
& Gold IP catalog as Bronze: softcore available, Silver:
silicon verified through UMC's Silicon Shuttle multi-chip test wafer
program, and Gold: mass production proven.
About Chipidea Microelectrónica, SA
Chipidea is a leading semiconductor IP Company headquartered in
Portugal providing solutions for complex connectivity, analog, mixed-signal
and digital signal processing applications. Chipidea works together
with all major open foundries as well as captive fabs from global
semiconductor firms. Its broad portfolio ranges from AD/DA converters
to Codecs, Power and Clock Management, AFEs for digital media and
communications, wireless transceivers and USB physical interfaces.
Chipidea employs over 160 people worldwide, with plans to reach
250 in 2006, and has offices in Europe, North America and Asia.
Chipidea can be found on the web at http://www.chipidea.com.
About UMC
UMC (NYSE: UMC, TSE: 2303) is a leading global semiconductor foundry
that manufactures advanced process ICs for applications spanning
every major sector of the semiconductor industry. UMC delivers cutting-edge
foundry technologies that enable sophisticated system-on-chip (SOC)
designs, including 90nm copper, 0.13um copper, embedded DRAM, and
mixed signal/RFCMOS. UMC is also a leader in 300mm manufacturing;
Fab 12A in Taiwan is currently in volume production for a variety
of customer products, while Singapore-based UMCi has just entered
volume production. UMC employs over 8,500 people worldwide and has
offices in Taiwan, Japan, Singapore, Europe, and the United States.
UMC can be found on the web at http://www.umc.com.
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