2009
UMC Press Releases
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| Dec. 15, 2009 |
UMC
Announces Completion of Tender Offer to UMC Japan |
| Dec. 10, 2009 |
UMC
Presents Paper on New Hybrid High-k/Metal Gate Approach for
28nm at 2009 IEDM |
| Nov. 30, 2009 |
UMC
Announces Exchangeable Bond Pricing |
| Oct. 28, 2009 |
UMC
proposed to acquire UMC Japan through Tender Offer |
| Oct. 28, 2009 |
UMC
3Q 2009 Financial Results |
| Oct. 19, 2009 |
UMC
Completes Environmental Production Declaration for Its Integrated
Circuit Wafers |
| Oct. 08, 2009 |
UMC
Fab 12i Migrates to 45/40nm Manufacturing |
| Sep. 16, 2009 |
UMC
First to Announce Carbon Footprint Verification on Integrated
Circuit Wafers |
| Sep. 8, 2009 |
UMC
Selected as a Global Component for Dow Jones Sustainability
Index
for Two Consecutive Years |
| Aug. 24, 2009 |
UMC
Announces the Establishment of New Business Development Center |
| Jul. 31, 2009 |
UMC
SG Opens Europe Sales Office in Singapore |
| Jul. 29, 2009 |
UMC
2Q 2009 Financial Results |
| Jul. 06, 2009 |
UMC's
2008 Corporate Social Responsibility (CSR) Report Verified by
DNV |
| Jun. 15, 2009 |
UMC
Announces Retirement of Mr. Tony Yu as President of UMC-USA
Office |
| Jun. 10, 2009 |
UMC
Shareholders Approve the Acquisition of He Jian Technology (Suzhou)
Co., Ltd. and Elect 11th term of Directors at Annual
Shareholders Meeting |
| May 08, 2009 |
UMC
Files Form 20-F for 2008 with US Securities and Exchange Commission |
| Apr. 29, 2009 |
UMC
Board of Directors Important Announcement |
| Apr. 29, 2009 |
UMC
1Q 2009 Financial Results |
| Apr. 27, 2009 |
UMC,
Springsoft Support Custom Chip Design with 65nm Process Design
Kit |
| Apr. 27, 2009 |
UMC
Recognized for Excellence by Texas Instruments |
| Apr. 22, 2009 |
UMC
Announces Board Meeting Approval for New Director Candidates |
| Apr. 8, 2009 |
UMC
Delivers Customer ICs Produced on its High Performance 40nm
Logic Technology |
| Feb. 10, 2009 |
UMC
4Q 2008 Financial Results |
| Feb. 9, 2009 |
UMC
Fab 12i Wins MediaTek's 2008 Best Fab Award
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