UMC Holds 2014 China Technology Forum
Foundry will highlight multiple UMC foundry advantages to China IC design customers
Hsinchu, Taiwan, April 18, 2014 – United Microelectronics Corporation (NYSE: UMC; TSE: 2303) ("UMC"), a leading global semiconductor foundry, today held its 2014 China Technology Forum at Kerry Hotel, Pudong Shanghai. China dominates the world smartphone end-user market with highly competitive 3C products that exhibit a high cost/performance (C/P) ratio; therefore, UMC’s forum theme this year is focused on optimized C/P foundry services for China IC design customers. UMC’s CEO, Po Wen Yen and other high-level management participated in the event, as well as two VIP guest speakers, Mr. Xu Xiaotian, executive vice chairman of China Semiconductor Industry Association (CSIA) and Dr. Wei Shaojun, vice chairman of CSIA and chairman of CSIA-IC Design Branch.
CEO Yen said, “China’s market development is essential to UMC. In 2013, we officially acquired China-based HeJian Technology as our key deployment in the country. Our next goal is to ensure that China IC design customers gain optimized C/P foundry solutions. We believe that with UMC’s 34 years of semiconductor experience and 20 years as a pure-play foundry, our solid foundation and rational, flexible approach will bring the best overall benefits to China customers for years to come.”
UMC focused on four C/P aspects during today’s forum:
Depth – Advanced Logic Technology
Research and development capability has always been UMC’s core strength. After completing the development of UMC’s own 28nm platform, UMC joined IBM’s R&D alliance to continue next generation process efforts to stay at the leading-edge of advanced technology development.
Breadth – Specialty Technology Leadership
UMC's strong R&D capabilities cover a wide range of processes. The comprehensive breadth of technology includes eFlash, CIS, eHV, BCD and others. Specialty production expands from UMC’s 0.11um aluminum that pushes the limit of 8-inch manufacturing to 12-inch production on 55nm/40nm, which will help maintain our industry forefront position in specialty technologies.
Value – added Solutions Turn-key Services
Aside from foundry manufacturing, UMC also partners with supply chain companies to provide diversified business models options. The foundry offers mask, wafer bumping, testing, packaging, 2.5D& 3D IC TSV technology, etc. UMC is constantly expanding its scale to provide one-stop services, allowing customers to choose an optimized C/P solution based on their different needs.
Time-to-Market Advantage – Design Enablement
UMC maximizes the efficiency of internal resources to accelerate new customer products to market. UMC’s comprehensive design support has added new services and strengthened existing support, including P&R services, CPU performance optimization, third-party IP one-stop service, customized FDK design kit, etc.
UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry that provides advanced technology and manufacturing for applications spanning every major sector of the IC industry. UMC’s robust foundry solutions allow chip designers to leverage the company’s leading-edge processes, which include 28nm poly-SiON and gate-last High-K/Metal Gate technology, mixed signal/RFCMOS, and a wide range of specialty technologies. Production is supported through 10 wafer manufacturing facilities that include two advanced 300mm fabs; Fab 12A in Taiwan and Singapore-based Fab 12i. Fab 12A consists of Phases 1-4 which are in production for customer products down to 28nm. Construction has been completed for Phases 5&6, with future plans for Phases 7&8. The company employs over 15,000 people worldwide and has offices in Taiwan, mainland China, Europe, Japan, Korea, Singapore, and the United States. UMC can be found on the web at http://www.umc.com.