We use cookies to improve your experience. By your continued use of this site you accept such use. To change your settings please see our Privacy Policy .
I Understand


  • Introduction
  • UMC's 22nm process has the advantages of reducing the die area by 10% compared with the 28nm HKMG process, along with having a better power efficiency ratio and enhanced RF performance. Optional devices are added to offer a more flexible analog design environment for system-on-chip (SoC) designs.

    The 22nm technology includes both ULP and ULL variations on the same platform. This super set combination of 22uLP and 22uLL can support voltages from 1.0V to 0.6V, helping customers enjoy the advantages of both technologies within one platform for their SoC designs.