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eNVM
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- Available to serve a broad range of applications from Smartcards, IoT/AIoT and Automotive
- 12” solutions from 55nm to 28nm with multi-generations of MCUs with eFLASH
- Our 40/55nm solutions have >40 customers and is in high volume production
- MCU with eNVM is developing advanced MRAM and ReRAM solutions with our leading IP partners
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Logic/MM/RFCMOS
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- Leading foundry to provide low power, low leakage features across different technology nodes
- Best cost to performance balance options for a vast range of applications, with connectivity functions (e.g. NBIoT, LPWAN etc.)
- Complete low power solutions with Multiple Vt, cell library, low power memory, RF model, IP options etc.
- >855M units shipped annually
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BCD/PMIC
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- >20% market share of PMIC foundry volume/revenue
- BCD+eFlash solution in development to drive higher efficiency for IoT and wearables
- State-of-the-art 180nm & 110nm BCD
- >10 years of 12” BCD manufacturing
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MEMS
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- Leading, unique cost saving material process for MEMS microphone designs
- Supports a wide range of applications from IoT (smart speakers and wearables) to Smart Mobile phones and industrial applications
- UMC’s fundamental set of >12 building blocks help customers construct a wide variety of MEMS designs with high volume, cost effective manufacturing solutions
- Volume production for MEMS microphone providers to tier 1 SMP and IoT customers
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