为增进此网站功能我们将在您的装置上传送 Cookies 功能。当您继续浏览本网站,我们将推定您已同意使用 Cookies,请见此连结
I Understand

随着互联网连接已成为我们日常生活的一部分,物联网相关产品已经快速地扩展到智能终端装置市场,而结合高性能及低功耗的半导体解决方案,为这些产品成功不可或缺的关键。物联网已广泛应用于智能家居、智能制造、智能城市和远距医疗等领域,而穿戴式装置在半导体创新技术的协助下,已实现长时间随时检测和信息传输,奠定其在健康管理的角色。

联电提供多样化的制程工艺解决方案,以推动物联网和穿戴式装置应用的发展,包括低功耗逻辑 / 混讯、嵌入式非挥发性记忆体,BCD 制程和微机电工艺,以协助客户实现未来的产品设计。通过不间断的工艺开发和与客户的紧密合作,联电成为领先的物联网晶圆专工厂和合作伙伴。

eNVM

  • Available to serve a broad range of applications from Smartcards, IoT/AIoT and Automotive
  • 12” solutions from 55nm to 28nm with multi-generations of MCUs with eFLASH
  • Our 40/55nm solutions have >40 customers and is in high volume production
  • MCU with eNVM is developing advanced MRAM and ReRAM solutions with our leading IP partners

Logic/MM/RFCMOS

  • Leading foundry to provide low power, low leakage features across different technology nodes
  • Best cost to performance balance options for a vast range of applications, with connectivity functions (e.g. NBIoT, LPWAN etc.)
  • Complete low power solutions with Multiple Vt, cell library, low power memory, RF model, IP options etc.
  • >855M units shipped annually

BCD/PMIC

  • >20% market share of PMIC foundry volume/revenue
  • BCD+eFlash solution in development to  drive higher efficiency for IoT and wearables
  • State-of-the-art 180nm & 110nm BCD
  • >10 years of 12” BCD manufacturing

MEMS

  • Leading, unique cost saving material process for MEMS microphone designs
  • Supports a wide range of applications from IoT (smart speakers and wearables) to Smart Mobile phones and industrial applications
  • UMC’s fundamental set of >12 building blocks help customers construct a wide variety of MEMS designs with high volume, cost effective manufacturing solutions
  • Volume production for MEMS microphone providers to tier 1 SMP and IoT customers
AIoT.jpg (150 KB)