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I Understand

随着行动和无线通讯进入 5G 时代,更宽的频宽,更低的讯号传输延迟以及海量连接的能力,将为我们的生活带来深远的改变。随着 Wi-Fi、蓝牙和低功耗广域网路 (LPWAN) 等无线连接技术不断的演进与发展,这些通讯技术的创新,将促使诸如智能手机、行动计算、智能制造等各种应用的半导体需求大幅增长。

身为晶圆专工的领导者,联华电子提供全面且具竞争力的工艺解决方案,包括逻辑、射频、高压制程、BCD 制程和嵌入式非挥发性记忆体工艺等,使客户可以选择适合的制程解决方案及元件为其行动和无线通讯芯片进行设计,以满足未来通讯产品的需求。

Logic/MM/RFCMOS

  • WW leading logic/MM and RFCMOS solution provider
  • Serving a wide range of applications, including embedded AP, digital/image/audio IC, RF transceiver, Wi-Fi, BT, mmWave etc.
  • Complete solution with Multiple Vt, cell library, RF model, IP options and low power features across different technology nodes
  • >5.7B units shipped annually

eHV

  • 1st among all foundries in global mobile DDIC shipments
  • End device applications cover smartphone, tablet and wearables
  • Technology leadership demonstrated from 180nm to 28nm
  • Leading foundry for 28nm AMOLED DDIC production

BCD/PMIC

  • >20% market share of PMIC foundry volume/revenue
  • >300M Mobile PMICs shipped in 2019
  • State-of-the-art 180nm & 110nm BCD solutions
  • >10 years of 12” BCD manufacturing

RFSOI

  • WW leading RFSOI provider with both capacitive and platform solutions offered
  • Suitable for RF front end component applications, such as RF switch, tuner, LNA in mobile or infrastructure device etc.
  • Solutions cover both 8-in and 12-in, from 0.18um to 55nm and beyond with excellent FOM
  • > 4.3B units shipped annually
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