Jan 07, 1999

UMC Group and NexflashTM Sign Agreement For 0.25m and 0.35m Embedded Flash Technologies

Santa Clara, Calif., January 7, 1999 - NexFlash Technologies, Inc., today announced that it has signed an agreement to license its patented 0.35 and 0.25-micron NexFlash™ process and design technologies to UMC Group. The agreement involves the transfer of flash memory manufacturing processes to UMC Group company, UTEK Semiconductor Corp. (UTEK). In addition, the agreement offers certain high density, high speed, and ultra low power flash memory designs for UMC Group customers to embed in their ASIC or logic products.

"This agreement is a significant step in the execution of our intellectual property licensing strategy, which targets fast growing embedded flash memory markets such as highly integrated microcontrollers and DSPs." said Mo Bandali, NexFlash's Chief Operating Officer. "As our strategic partner, UMC Group can help us reach a broad customer base. Its excellent wafer production facilities also complement our embedded flash designs."

Jim Kupec, president of UMC Group (USA) said, "Embedded memories are a critical part of UMC Group's foundry strategy. With the era of system-on-chip (SOC) designs upon us, we have made an extensive catalog of mega-cell block resources available to our customers through our Gold IP™ program. Embedded non-volatile memories are a key piece to our SOC solution, and NexFlash's excellent technology will enable UMC Group customers to quickly and cost-efficiently produce designs for a wide-range of applications."

NexFlash has established the goal of becoming the vendor of choice for embedded flash designs. Central to its core intellectual properties are several fundamental flash memory patents covering the memory cell architecture and operations in the Fowler-Nordheim tunneling mode. This technology has the benefit of very low power, low voltage, small memory sectors, and fast access/ programming/erase time. Additionally, the technology integrates well with manufacturing processes for ASIC or other logic products.

"We are very excited about this relationship with UMC Group, and we look forward to working with them for our mutual success." Mr. Bandali said.

About NexFlash Technologies

NexFlash Technologies, Inc. is focused on designing and marketing high density, low power flash memory devices, as well as licensing flash memory designs for customers' embedded memory products. NexFlash products are used in telecommunications, data communications, networking systems, personal computers, instrumentation and consumer products.

我們重視您的隱私
我們的網站使用 cookies 來增強您的使用體驗和功能,並分析網站的使用方式,以便在未來進行改進。選擇「全部接受」以繼續,或到「偏好設定」以設置您的偏好。
全部接受
偏好設定
我們重視您的隱私
為獲得最佳使用體驗,請選擇「全部接受」以同意我們使用所有 cookies。或者可以在下方選擇停用「功能及效能提升 cookies」。有關聯華電子和第三方在本網站使用 cookies 的更多資訊,請參閱我們的 Cookie 政策
全部接受
選項管理
  • 絕對必要 cookies
    永遠使用
    必要性 cookies 將有助於您在網站內移動並正常使用其功能,例如設置您的隱私偏好,登錄或填寫表格。如果沒有這些 Cookies,則網站將無法正確提供該服務。您可以選擇網路瀏覽器不使用必要性 cookies,但隨後您可能無法按預期使用網站的功能。
  • 功能及效能提升 cookies
    這些 cookies 收集有關到訪者如何使用網站的資訊,例如到訪者最常瀏覽的頁面,及如何在網站中移動,以幫助我們改善網站的操作,從而優化使用者體驗。
確認