BACK-END SERVICES

Turn-key Solutions

Value Added Backend Services

UMC provides customers with a comprehensive backend service scope While all these services shown above are available. All checks after wafer processing are covered by the backend service scope, including bumping, wafer sorting and yield management. Full turnkey services cover packaging and final test.

To increase efficiency and leverage the core competencies of our partners, instead of building our own bumping fab and assembly line, UMC delivers full backend services through close partnerships with customer preferred OSATs. This flexible business model provides customers with multiple options to meet their backend requirements.

As a backend service to customers, we also run a proactive yield management system to continuously improve product yield when UMC manufactures your wafers. This value-added competitive advantage is above and beyond what is performed at a traditional testing house.

UMC Backend Service Model

When you select UMC as your foundry partner, multiple backend service options become available to meet specific customer requirements. We operate on an open architecture service model that provides several different turnkey solutions. UMC can also create specific, customized working flows such as using preferred OSATs or only allowing in-house sorting. We operate a Comprehensive Quality Assurance System for OSAT Management.

If needed, UMC will also provide CP sorting services for customers. With in-house CP, we are well experienced in providing short turnaround times, and timely yield feedback to enable high quality yield enhancement.

Total Solutions for Quality Turnkey Service

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