Governance

As part of its sustainability strategy, UMC aims to increase investment in technologies that deliver enhanced energy efficiency, reducing carbon emissions along the value chain as well as the carbon footprints of end-products. UMC's technologies also contribute to global climate change mitigation by providing semiconductors to power electric vehicles, smart energy management systems, industrial automation, and optimization technology and systems. To align its technology development roadmap with carbon reduction goals, the company has set incremental goals through 2030 to expand the proportion of overall revenue derived from sustainable products.

UMC offers ultra-low power (ULP) and ultra-low leakage (ULL) logic technology platforms, which can be integrated with the company's leading specialty processes to enhance energy saving characteristics of end-products.

For its 28nm logic process, UMC provides two types of high-performance and ultra-low-power options to suit different customer needs, including automotive applications. The 22nm logic process platform provides lower core operating voltage, demonstrating ultra-low leakage and energy-saving features. The 14nm process is more suitable for computing and data processing due to its high performance, low power consumption and low latency.

UMC offers state-of-the-art eNVM solutions to meet a variety of embedded system applications. In addition to the standard eNVM solutions, UMC has also successfully developed resistive memory (RRAM) and magnetoresistive memory (MRAM) technologies, which can be embedded in logic processes and operate with very low standby electrical current, reducing the power consumption of products in end applications. Coupled with robust logic processes for peripheral devices, UMC produces energy efficient microcontrollers for a range of applications including automotive, smart factory, and consumer products.

UMC has the industry's broadest portfolio of eHV process technologies and corresponding intellectual property solutions for display panel driver chips of all sizes. UMC's ultra-low leakage solution enables customers to integrate control logic, gate drivers, source drivers, and memories on the same IC to form a system-on-chip (SoC), which can achieve multiplexing and improve product performance without increasing power consumption.

UMC's BCD platforms, backed by comprehensive eNVM options, deliver complete power management functions in a single chip. Customers' power management ICs produced using BCD technology exhibit lower energy loss during voltage conversion and boast a smaller form factor, making it a preferred solution for developing end-products that is more energy efficient.

UMC's RFSOI technology, with its unique substrate characteristics capable of preventing low and high frequency doubled harmonics and reducing power loss, exhibits outstanding energy efficiency in end applications.