300-mm Manufacturing Leadership

UMC is a 300mm manufacturing leader with two advanced 300mm fabs in operation. Fab 12A in Tainan, Taiwan has been in volume production for customer products since 2002 and is currently manufacturing the industry's most advanced 40nm products. Fab 12A's production capacity is currently 30,000 wafers per month. UMC's second 300mm fab, Fab 12i, is located in Singapore's Pasir Ris Wafer Park. This second-generation 300mm facility is also in volume production, with capacity at 30,000 wafers per month. The advanced automation, mature defect density, and competitive cycle times along with a customer-driven capacity expansion plan enable UMC to be the foundry of choice for customers' manufacturing needs.

Competitiveness through Productivity

300mm wafers have over twice the usable area as 200mm wafers, delivering productivity advantages of up 2.5 times the number of chips. This translates directly into greater competitive advantages for our customers. UMC's 300mm facilities utilize state-of-the-art computer integrated manufacturing (CIM), which together with our extensive 300mm experience, has allowed UMC to achieve 300mm yields and cycle times comparable to our 200mm manufacturing.

Larger Die Sizes More Efficiently Utilize 300mm Wafer Area

Back to Top

Advanced Automation

Wafers are transported automatically in a Front Opening Universal Pod (FOUP) that has a capacity of 25 wafers. In addition, lot movement is executed using Automated Material Handling System (AMHS) for interbay moves, which hand off the FOUPs to Rail Guided Vehicles (RGV) for intrabay moves. This system is typically around 3 to 4 times faster than the standard Automatic Guided Vehicle (AGV) intrabay system common in 200-mm fabs. In addition, 12i in Singapore features equipment-to-equipment communication technology to further increase operating efficiency.

300Fab Automation- UMC responds to the rigorous requirements for manufacturing efficiency, flexibility, and control with state-of-the art automated systems featureing Front Opening Universal Pods(FOUPs), Automated Material Handling Systems (AMHs), and overhead Rail Guided Vehicle (RGV).

Ultimately, UMC's leadership in 300mm production results in increased cost-efficiency and faster time to market for our customers. As die size increases with more and more advanced technology features being integrated into today's system on chip (SOC) designs, these factors become increasingly important for companies to maintain their competitiveness.