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UMC Board of Directors Announces Proposals for its Annual Shareholders Meeting

 

Taipei, Taiwan, R.O.C. –March 12, 2014 – United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) ("UMC"), at a meeting of the Board of Directors held today, approved the 2013 Business Report and Financial Statements, and set the agenda for the Annual General Meeting. A brief summary of major recognition and discussion items is as follows:

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Approved the 2013 Business Report and Financial Statements. The consolidated revenue for 2013 was NT$123,812 million and net income attributable to stockholders of the parent was NT$12,630 million, with earnings per share of NT$1.01.

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Shareholder cash dividend of NT$6,249 million, at approximately NT$0.50 per share.

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Employee cash bonus of NT$1,163 million.


Other major resolutions of today's Board Meeting:

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Authorized a capital budget execution of NT$4,948 million for capacity deployment.

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Approved the termination of the issuance plan for private placement ratified during the 2013 Annual General Meeting.

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Approved the proposal of private placement plan in the 2014 Annual General Meeting to fulfill operational needs.

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Approved a donation of NT$10.8 million bestowed to UMC Science and Culture Foundation.

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The 2014 Annual General Meeting will be held at 9:00AM on Wednesday, June 11, 2014 at UMC’s Fab 8S Conference Hall, located at No.16, Creation Rd. 1, Hsinchu Science Park.


About UMC
UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry that provides advanced technology and manufacturing for applications spanning every major sector of the IC industry. UMC’s robust foundry solutions allow chip designers to leverage the company’s leading-edge processes, which include 28nm poly-SiON and gate-last High-K/Metal Gate technology, mixed signal/RFCMOS, and a wide range of specialty technologies. Production is supported through 10 wafer manufacturing facilities that include two advanced 300mm fabs; Fab 12A in Taiwan and Singapore-based Fab 12i. Fab 12A consists of Phases 1-4 which are in production for customer products down to 28nm. Construction has been completed for Phases 5&6, with future plans for Phases 7&8. The company employs over 15,000 people worldwide and has offices in Taiwan, mainland China, Europe, Japan, Korea, Singapore, and the United States. UMC can be found on the web at http://www.umc.com.

Note From UMC Concerning Forward-Looking Statements
Some of the statements in the foregoing announcement are forward looking within the meaning of the U.S. Federal Securities laws, including statements about future outsourcing, wafer capacity, technologies, business relationships and market conditions. Investors are cautioned that actual events and results could differ materially from these statements as a result of a variety of factors, including conditions in the overall semiconductor market and economy; acceptance and demand for products from UMC; and technological and development risks. Further information regarding these and other risks is included in UMC’s filings with the U.S. Securities and Exchange Commission, including its registration statements and reports on Forms F-1, F-3, F-6 and 20-F and 6-K, in each case as amended. UMC does not undertake any obligation to update any forward-looking statement as a result of new information, future events or otherwise, except as required under applicable law.


 

 

Bowen Huang / David Wong
UMC, Investor Relations
Tel: + 886-2-2658-9168, ext. 16900
bowen_huang@umc.com
david_wong@umc.com

 

   

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