Hsinchu, Taiwan and Neubiberg/Munich Germany, October 28, 2014 - United Microelectronics Corporation (NYSE: UMC; TSE: 2303) ("UMC"), a leading global semiconductor foundry, and Lantiq, a leading supplier of broadband access and home networking technologies, today announced that UMC has entered volume production for Lantiq’s SPT170 high voltage Power Management ICs (PMIC) used for landline applications. The SPT170 offers the industry’s highest breakdown voltage of all subscriber line interface circuit (SLIC) technologies used in the market, incorporating a custom 2.0um process developed by Infineon Technologies that can handle voltages of up to 170 volts. This high voltage durability provides a robust and reliable interface solution for landlines, which face notoriously harsh environments that include lightning strikes and unintended power contact to the line.

J H Shyu, senior vice president of Production and Operation Integration at UMC said, “Although UMC has been an integral player in the mobile communication revolution, we are also addressing the requirements of landlines, which remain the practical choice for use in homes, offices and institutions. With over 1 billion landlines in operation across the globe, we are happy to address this market with UMC’s volume production of Lantiq’s SPT170 ICs. We look forward to bringing Lantiq’s other products to fruition in the near future.”

Dominik Bilo, COO of Lantiq, “With the delivery of highest quality semiconductor production and excellence in leading-edge processes, UMC is an extremely valuable partner for our manufacturing strategy. We rely on their high-tech expertise and proven processes. With the successful transfer of our SPT170 technology, we ensure consistent production of our mature and field proven voice solutions for many years to come - standing firm behind our product roadmap.”

UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry that provides advanced technology and manufacturing for applications spanning every major sector of the IC industry. UMC’s robust foundry solutions allow chip designers to leverage the company’s leading-edge processes, which include 28nm poly-SiON and gate-last High-K/Metal Gate technology, mixed signal/RFCMOS, and a wide range of specialty technologies. Production is supported through 10 wafer manufacturing facilities that include two advanced 300mm fabs; Fab 12A in Taiwan and Singapore-based Fab 12i. Fab 12A consists of Phases 1-4 which are in production for customer products down to 28nm. Construction has been completed for Phases 5&6, with future plans for Phases 7&8. The company employs over 15,000 people worldwide and has offices in Taiwan, mainland China, Europe, Japan, Korea, Singapore, and the United States. UMC can be found on the web at https://www.umc.com.

Lantiq enables Carrier Innovations for Next Generation Networks and the Digital Home. Lantiq is a global provider of innovative semiconductor solutions powering broadband, next generation networks and the digital home. With a long history of industry success and leadership, Lantiq’s semiconductor and complementary software solutions are deployed by major carriers and in home networks in every region of the world. Specializing in broadband communications, including analog, digital and mixed-signal ICs, as well as complementary comprehensive software suites, Lantiq enables system manufacturers to design high-speed data and telecommunication systems solutions for broadband access and customer premises equipment.

Note from UMC Concerning Forward-Looking Statements
Some of the statements in the foregoing announcement are forward looking within the meaning of the U.S. Federal Securities laws, including statements about future outsourcing, wafer capacity, technologies, business relationships and market conditions. Investors are cautioned that actual events and results could differ materially from these statements as a result of a variety of factors, including conditions in the overall semiconductor market and economy; acceptance and demand for products from UMC; and technological and development risks. Further information regarding these and other risks is included in UMC’s filings with the U.S. Securities and Exchange Commission, including its registration statements and reports on Forms F-1, F-3, F-6, 20-F and 6-K, in each case as amended. UMC does not undertake any obligation to update any forward-looking statement as a result of new information, future events or otherwise, except as required under applicable law.