UMC Unveils UMC AutoSM Platform to Enable Automotive IC Designs
Multiple manufacturing certifications for security, reliability and robustness provide customers with stable and high-quality auto IC production
Hsinchu, Taiwan, May 26, 2015 – United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) ("UMC"), a leading global semiconductor foundry, today unveiled its UMC AutoSM technology platform to target IC companies designing chips for automotive applications. UMC Auto is a comprehensive platform that consists of a broad portfolio of automotive AEC-Q100 qualified technology solutions ranging from 0.5um to 28nm nodes, backed by robust manufacturing processes that comply with rigorous ISO TS-16949 automotive quality standards for all UMC fabs. In addition, UMC is selectively developing certified design models, IP, and Foundry Design Kits specific to the UMC Auto platform in order to fulfill the increasing pace of evolvement of the auto industry supply chain, helping chip designers capture new market opportunities as Internet of Things (IoT) and increased use of sensors permeate into auto applications.
“With the rapid rise in silicon content within each new vehicle, many believe the automotive IC sector will experience the highest CAGR compared with other semiconductor segments,” said Po Wen Yen, CEO of UMC. “UMC has a successful history as an automotive IC supplier, being the first foundry to receive ISO 22301 certification for our business continuity management system and implementing a comprehensive “Automotive Service Package” that incorporates zero-defect practices within our manufacturing procedures. We look forward to enabling more customers to realize the opportunities within the automotive IC market through our innovative UMC Auto solutions platform.”
UMC is currently producing various key electronic components used in vehicles, including Advanced Driver Assistance Systems (ADAS), safety, body control, infotainment and under-hood applications. These ICs manufactured at UMC have been widely adopted by the world's most well-known carmakers in Japan, Europe, Asia and the United States.
UMC's auto IC manufacturing lines meet or exceed the automotive industry's most stringent quality and reliability criteria, including the highest rated AEC-Q100 Grade-0 certification for its fab manufacturing. UMC was also the first foundry in Taiwan to provide IC manufacturing services that comply with ISO 15408 Common Criteria, joining an elite 1% of all companies and products worldwide to be certified ISO 15408 EAL6 or above. This security qualification signifies UMC's ability to provide rigorous security protection during the manufacturing process, which is required by the majority of IC products deployed in sensitive applications that need to be highly secure such as automotive sensors for door locks, navigation, etc.
UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry that provides advanced IC production for applications spanning every major sector of the electronics industry. UMC's robust foundry solutions enable chip designers to leverage the company's sophisticated technology and manufacturing, which include 28nm gate-last High-K/Metal Gate technology, ultra-low power platform processes specifically engineered for Internet of Things (IoT) applications and the highest-rated AEC-Q11 Grade-0 automotive industry manufacturing capabilities. UMC's 10 wafer fabs are located throughout Asia and are able to produce over 500,000 wafers per month. The company employs over 17,000 people worldwide, with offices in Taiwan, mainland China, Europe, Japan, Korea, Singapore, and the United States. UMC can be found on the web at http://www.umc.com.
Note from UMC Concerning Forward-Looking Statements
Some of the statements in the foregoing announcement are forward looking within the meaning of the U.S. Federal Securities laws, including statements about future outsourcing, wafer capacity, technologies, business relationships and market conditions. Investors are cautioned that actual events and results could differ materially from these statements as a result of a variety of factors, including conditions in the overall semiconductor market and economy; acceptance and demand for products from UMC; and technological and development risks. Further information regarding these and other risks is included in UMC's filings with the U.S. Securities and Exchange Commission, including its registration statements and reports on Forms F-1, F-3, F-6 and 20-F and 6-K, in each case as amended. UMC does not undertake any obligation to update any forward-looking statement as a result of new information, future events or otherwise, except as required under applicable law.