Hsinchu, Taiwan, June 5, 2015 - United Microelectronics Corporation (NYSE: UMC; TSE: 2303) ("UMC"), a leading global semiconductor foundry, today held its 2015 China Technology Forum at Kerry Hotel, Pudong Shanghai. UMC's forum theme this year is focused on the foundry's leading technology and manufacturing solutions for the high growth Internet-of-Things (IoT) market, which is expected to become a major growth driver for China's semiconductor industry in the coming years. UMC's CEO, Po Wen Yen delivered the keynote speech, as well as two VIP guest speakers, Executive Vice Chairman Xu Xiao Tian from China Semiconductor Industry Association and President Li Shu Chong from CCID Consulting Co.

CEO Yen said, “UMC has built a strong, local infrastructure to support our China-based customers, including our HeJian 8” fab in Suzhou as well as our United Semi 12” joint venture currently under construction in Xiamen. We have also established United Design Service in Jinan, Shandong to provide local turnkey IC design convenience to help speed time-to-market. With our 35 years of semiconductor experience, strong local support for China and foundy's most competitive specialty process technologies, UMC is best positioned to serve China's IoT chip designers.”

UMC has built the foundry industry's first integrated IoT platform, using UMC's ultra-low power (uLP) technology as a foundation. The fusion platform builds upon the process base with ultra-low power variations of MCU, embedded non-volatile memory options and RFCMOS to enable “always connected” status within an ultra-low-power environment to extend battery life. The foundry's strong uLP IP portfolio ensures that IoT designs will run at lower Vdd, with APR support to maximize design success.

UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry that provides advanced IC production for applications spanning every major sector of the electronics industry. UMC's robust foundry solutions enable chip designers to leverage the company's sophisticated technology and manufacturing, which include 28nm gate-last High-K/Metal Gate technology, ultra-low power platform processes specifically engineered for Internet of Things (IoT) applications and the highest-rated AEC-Q11 Grade-0 automotive industry manufacturing capabilities. UMC's 10 wafer fabs are located throughout Asia and are able to produce over 500,000 wafers per month. The company employs over 17,000 people worldwide, with offices in Taiwan, mainland China, Europe, Japan, Korea, Singapore, and the United States. UMC can be found on the web at http://www.umc.com.

Note from UMC Concerning Forward-Looking Statements
Some of the statements in the foregoing announcement are forward looking within the meaning of the U.S. Federal Securities laws, including statements about future outsourcing, wafer capacity, technologies, business relationships and market conditions. Investors are cautioned that actual events and results could differ materially from these statements as a result of a variety of factors, including conditions in the overall semiconductor market and economy; acceptance and demand for products from UMC; and technological and development risks. Further information regarding these and other risks is included in UMC's filings with the U.S. Securities and Exchange Commission, including its registration statements and reports on Forms F-1, F-3, F-6 and 20-F and 6-K, in each case as amended. UMC does not undertake any obligation to update any forward-looking statement as a result of new information, future events or otherwise, except as required under applicable law.