UMC Holds 2016 Japan Technology Forum
“Innovation by Collaboration” and competitive process technologies are key topics to be highlighted
Tokyo, Japan, May 24, 2016 – United Microelectronics Corporation (NYSE: UMC; TSE: 2303) ("UMC"), a leading global semiconductor foundry, today held its 2016 Japan Technology Forum at the Tokyo International Forum. UMC’s forum theme this year is focused on the foundry’s “Innovation by Collaboration” business model that leverages strategic partnerships to realize accelerated, mutual success in areas such as R&D, IP, market development and bringing customer products to timely volume production. The event also serves as a platform for UMC and its ecosystem partners to showcase their strengths in process technology, manufacturing, EDA, IP, testing, packaging and market applications to support Japan IDM and fabless companies. UMC’s CEO, Po Wen Yen, presented the opening remarks, while Ryo Ogura, president & CEO of New Japan Radio (NJR), delivered the guest keynote speech.
CEO Yen said, “Japan’s high-tech segments are experiencing a new wave of growth in new applications such as automotive ICs, IOT, AR/VR, UAV, medical and robot. These diverse vertical markets require strong partnerships and comprehensive technologies in order to realize customized application specific solutions.”
Mr. Yen continued, “UMC’s success in delivering rapid results for our foundry customers is a product of our ability to closely collaborate with customers and supply chain partners. We collaborate with customers to create customized technologies that provide essential product differentiation in the marketplace, while also offering specialized IP and application platforms to streamline customer engagement with UMC. We look forward to bringing these competitive advantages to our Japan-based customers.”
In addition to highlighting UMC’s partnership model at the technology forum, the foundry will also showcase its competitive technology offerings such as 14nm FinFET, volume production 28nm high-k/metal gate, RFSOI, MEMS, 2.5D/3DIC, BCD and automotive IC grade 1 and grade 0 manufacturing capabilities. UMC operates a sales office in Tokyo, and is a joint venture partner in Mie Fujitsu Semiconductor (MIFS), a 300mm foundry company in Mie prefecture, Japan. The company is also in the equipment move-in phase for its new 12” United Semi joint venture fab located in Xiamen, China, which is scheduled for production in late 2016.
UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry that provides advanced IC production for applications spanning every major sector of the electronics industry. UMC’s robust foundry solutions enable chip designers to leverage the company’s sophisticated technology and manufacturing, which include 28nm gate-last High-K/Metal Gate technology, ultra-low power platform processes specifically engineered for Internet of Things (IoT) applications and the highest-rated AEC-Q11 Grade-0 automotive industry manufacturing capabilities. UMC’s 10 wafer fabs are located throughout Asia and are able to produce over 500,000 wafers per month. The company employs over 17,000 people worldwide, with offices in Taiwan, mainland China, Europe, Japan, Korea, Singapore, and the United States. UMC can be found on the web at http://www.umc.com.
Note From UMC Concerning Forward-Looking Statements
Some of the statements in the foregoing announcement are forward looking within the meaning of the U.S. Federal Securities laws, including statements about future outsourcing, wafer capacity, technologies, business relationships and market conditions. Investors are cautioned that actual events and results could differ materially from these statements as a result of a variety of factors, including conditions in the overall semiconductor market and economy; acceptance and demand for products from UMC; and technological and development risks. Further information regarding these and other risks is included in UMC’s filings with the U.S. Securities and Exchange Commission, including its registration statements and reports on Forms F-1, F-3, F-6 and 20-F and 6-K, in each case as amended. UMC does not undertake any obligation to update any forward-looking statement as a result of new information, future events or otherwise, except as required under applicable law.