UMC Forges Strategic Partnership with APM to Enhance MEMS Service Capabilities
Hsinchu, Taiwan, September 5, 2016 – United Microelectronics Corporation (NYSE:UMC; TWSE: 2303) ("UMC"), a leading global semiconductor foundry, and dedicated MEMS foundry Asia Pacific Microsystems, Inc. (APM), today announced a collaboration to provide enhanced MEMS manufacturing services for mutual customers. UMC will leverage its 8” and 12” production capabilities with APM’s 6” fab and extensive MEMS know-how and prototyping experience to provide chip designers with a flexible and scalable end-to-end MEMS manufacturing solution.
“UMC has been highly successful in producing MEMS products for microphone, accelerometer and environmental sensor applications,” said S.C. Chien, senior vice president of Corporate Marketing division at UMC. “Partnering with APM allows us to broaden our MEMS addressable market to serve a wider range of customers targeting the growing Internet-of-Things (IoT) sector, such as system companies, module providers and designers of new MEMS chips. This alliance will also provide customers with greater working model flexibility, as APM can provide full turnkey service, MEMS prototyping and small volume manufacturing, while UMC delivers process porting capability for mainstream, volume production MEMS products that are ready to migrate to more productive and cost effective 8” manufacturing. Moreover, customers can combine their MEMS modules with UMC’s advanced 12” CMOS fab processes to introduce state-of-the-art MEMS features within an ASIC design.”
The emerging IoT era is driving the rapid growth of MEMS sensors and actuators within today’s smart devices. Different from logic IC chips, MEMS devices focus on using mechanical, electrical, and optical microstructures within microchips to facilitate a non-electrical interaction or response with the environment. MEMS used in today’s automotive, consumer electronics, data communication and biomedical industry face a common issue, in that design development and implementation is unexpectedly complicated and highly time-consuming. The joint effort of UMC and APM’s engineering teams will help shorten the initial MEMS development cycle and provide ample, scalable production capacity with competitive manufacturing efficiency to successfully and rapidly commercialize MEMS chips for foundry customers.
K.H. Jao, president of APM said, “APM brings over 15 years of MEMS experience in design, manufacturing and packaging to our partnership with UMC. Our flexible process capability and process module blocks address different customized chip requirements including sensor, actuator and microstructure, which enable customers to streamline their unique MEMS IC designs to market. We are excited to cooperate with UMC, and believe the synergies created not only by our two companies’ complementary services, but also by our close proximity in Hsinchu to UMC and numerous semiconductor suppliers, MEMS packaging & testing providers, will provide unmatched speed and supply chain advantages to MEMS customers worldwide.”
Founded in 2001, APM is one of the world’s leading pure-play MEMS foundry service providers. It is currently running 6-inch MEMS wafer fab composed of a broad range of MEMS fabrication capabilities at Hsinchu Science Park of Taiwan. APM serves many global customers who are designing state-of-art MEMS sensors and actuators, such as pressure and environmental sensors, inertia sensors, microphones, bio-sensors, light sensors and IR sensors. APM is also ISO 9001, ISO14001 and TS16949 certified. For more information: www.apmsinc.com
UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry that provides advanced IC production for applications spanning every major sector of the electronics industry. UMC’s robust foundry solutions enable chip designers to leverage the company’s sophisticated technology and manufacturing, which include volume production 28nm gate-last High-K/Metal Gate technology, ultra-low power platform processes specifically engineered for Internet of Things (IoT) applications and the automotive industry’s highest-rated AEC-Q100 Grade-0 manufacturing capabilities for production of ICs found in cars. UMC’s 10 wafer fabs are strategically located throughout Asia and are able to produce over 500,000 wafers per month. The company employs more than 17,000 people worldwide, with offices in Taiwan, mainland China, Europe, Japan, Korea, Singapore, and the United States. UMC can be found on the web at http://www.umc.com.
Note From UMC Concerning Forward-Looking Statements
Some of the statements in the foregoing announcement are forward-looking within the meaning of the U.S. Federal Securities laws, including statements about introduction of new services and technologies, future outsourcing, competition, wafer capacity, business relationships and market conditions. Investors are cautioned that actual events and results could differ materially from these statements as a result of a variety of factors, including conditions in the overall semiconductor market and economy; acceptance and demand for products from UMC; and technological and development risks. Further information regarding these and other risks is included in UMC’s filings with the U.S. Securities and Exchange Commission. UMC does not undertake any obligation to update any forward-looking statement as a result of new information, future events or otherwise, except as required under applicable law.