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UMC Holds 2018 China Technology Forum

UMC highlights its solutions to enable “IC 2.0” for an Intelligently Connected world

 

Hsinchu, Taiwan, May 24, 2018 – United Microelectronics Corporation (NYSE: UMC; TSE: 2303) ("UMC"), a leading global semiconductor foundry, today held its 2018 China Technology Forum at Jumeirah Himalayas Hotel Shanghai in Shanghai, China. UMC detailed its foundry solutions that drive the company's “IC 2.0,” or Intelligently Connected theme, including its specialized technologies, IP, and strong China manufacturing presence to serve China customers designing chips for AI, 5G, IoT and automotive applications. UMC's co-president SC Chien delivered the keynote address to over 200 customers and supply chain partners from China's semiconductor industry.

President Chien said, “The Intelligently Connected era, which we call IC 2.0, will open up a new realm of possibilities with regard to new chips in 5G, AI, IoT, and automotive being introduced into our everyday lives. UMC will help Chinese design houses take early advantage of these high growth opportunities, as we have leveraged our decades of world-class semiconductor manufacturing experience with custom engineered foundry solutions specifically directed at Intelligent Connectivity to become the best foundry choice for chip designers.”

UMC's China manufacturing base consists of HeJian, a high capacity 8” inch fab in Suzhou, and Fax 12X, an advanced 12” fab located in Xiamen that is in high yield volume production for technologies including 40nm and 28nm High-K/Metal-Gate. The company also operates United Design Service in Shandong, which offers turnkey design service to China customers.

About UMC
UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry that provides advanced IC production for applications spanning every major sector of the electronics industry. UMC's comprehensive foundry solutions enable chip designers to leverage the company's sophisticated technology and manufacturing, which include high volume 28nm High-K/Metal Gate technology, 14nm FinFET mass production, ultra-low power platform processes specifically developed for Internet of Things (IoT) applications and the automotive industry's highest-rated AEC-Q100 Grade-0 manufacturing capabilities for the production of ICs found in vehicles. UMC's 11 wafer fabs are strategically located throughout Asia and are able to produce nearly 600,000 wafers per month. The company employs over 20,000 people worldwide, with offices in Taiwan, China, Europe, Japan, Korea, Singapore, and the United States. UMC can be found on the web at http://www.umc.com.

Note from UMC Concerning Forward-Looking Statements
Some of the statements in the foregoing announcement are forward looking within the meaning of the U.S. Federal Securities laws, including statements about future outsourcing, wafer capacity, technologies, business relationships and market conditions. Investors are cautioned that actual events and results could differ materially from these statements as a result of a variety of factors, including conditions in the overall semiconductor market and economy; acceptance and demand for products from UMC; and technological and development risks. Further information regarding these and other risks is included in UMC's filings with the U.S. Securities and Exchange Commission, including its registration statements and reports on Forms F-1, F-3, F-6 and 20-F and 6-K, in each case as amended. UMC does not undertake any obligation to update any forward-looking statement as a result of new information, future events or otherwise, except as required under applicable law.


 

 

UMC
UMC Corporate Communications
Richard Yu
+886-2-2658-9168 ext. 16951
richard_yu@umc.com

 
   

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