Process Technologies

RF Technologies

RFCMOS

UMC's remarkable RFCMOS performance exceeds the guidelines from the ITRS industry roadmap. Our RFCMOS platform is based on our standard logic process to deliver a high performance, low cost solution for RFIC designs that includes comprehensive design kits and library support.. UMC's RFCMOS technologies span from 0.25µm to 28nm process nodes.

Key Features of UMC’s RFCMOS include high-speed RF N/PMOS, advanced RF modeling with multi-dimensional device scaling range, enhanced thermal noise model, accurate flicker noise model and statistical model to predict circuit behavior correlated with the process. Cost effective MOM and MIM, scalable inductors and high precision resistors offer optimal design and cost advantages for RFCMOS customers.

The successful design of an RF SoC requires a solution that provides access to EDA tools as well as foundry technology and design support. UMC's FDK (Foundry Design Kit) offers a user-friendly platform that integrates schematic entry, simulation, layout editor, parameter extraction, and layout check all within one package. The unique virtual inductor / capacitor libraries provide faster inductor / capacitor simulation for RF designers who can now design “optimized inductors / capacitors” within a few minutes. These robust solutions make UMC’s RFCMOS process one of the most competitive in the foundry industry.

Application

UMC's rich Mixed Signal/RFCMOS technology platform and dual process approach satisfies the rigorous requirements of all major market applications.


MS / RFCMOS Technology Platform

RFSOI

UMC’s RFSOI technology is built on a cost-effective CMOS-based process that satisfies the rigorous RF switch requirements of all cellular market applications to deliver best-in-class performance. Our RFSOI platform features RF N/PMOS, advanced RF modeling with a multi-dimensional device scaling range and accurate statistical models to predict circuit behavior correlated with the process. High density and high voltage MIM, scalable inductors and high precision resistors offer optimal design and cost advantages for RFSOI customers.

UMC's RFSOI process portfolio has been successfully adopted by major smartphone makers. The process is complemented by:

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Complete EDA tools as well as technology and design support.

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UMC's FDK (Foundry Design Kit), which offers a user-friendly platform that integrates schematic entry, simulation, layout editor, parameter extraction, and layout check all within one package.

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The unique virtual inductor libraries, which provide faster inductor simulation for RF designers who can now design “optimized inductors” within a few minutes.

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Robust manufacturing expertise, with more than a hundred thousand wafers already shipped.

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