Group Produces Industry-Leading 0.25-micron 3D Chip for S3. Engineers
produce masks and working silicon in less than 20 days
Sunnyvale, Calif., August 17, 1998 ¡V UMC Group, a worldwide leader
in semiconductor foundry services and the first semiconductor foundry
to implement 0.25-micron production, today announced full production
shipping of S3 Incorporated's (Nasdaq: SIII) industry-leading 128-bit
Savage3D accelerator chip using 0.25-micron process technology.
release of the Savage3D design from S3, UMC Group produced masks
and working silicon in less than 20 days¡Xa record for 0.25 micron
processing by both UMC Group and S3. The Savage 3D product was announced
in May and mass production started in early July. Delivering winning
3D performance, state-of-the-art AGP throughput and video/DVD quality,
the Savage3D accelerator is aimed at the high-end PC market and
will be manufactured in high-volume by UMC Group's 0.25-micron USC
Group's lead in deep sub-micron technologies, coupled with its manufacturing
prowess, match S3's product objectives of price and performance
while meeting high-volume market demand," stated Paul Franklin,
senior vice president of operations for S3 Incorporated.
Group's leadership in process technology and fully integrated foundry
services provides our customers and partners a competitive edge,"
said Jim Ballingall, vice president of worldwide marketing at UMC
Group. "By reducing development cycles and accelerating time
to market, we have become the entry point for the production of
successful deep sub-micron designs."
Incorporated, founded in 1989 with headquarters in Santa Clara,
California, is a premier supplier of multimedia acceleration hardware
and its associated software. S3 is committed to applying its expertise
in graphics and video and platform acceleration to create innovative
and affordable products for the home, desktop and mobile markets.
is a registered trademark of S3 Incorporated. The S3 corporate logo,
Savage3D and S3TC are trademarks of S3 Incorporated. Other marks
referenced herein are the property of their respective owners.