2001 UMC Press Releases |
Dec. 18, 2001 |
UMC
Statement Regarding Recent Taiwan Earthquake |
Dec. 5, 2001 |
UMC
Raises $302 Million Through Zero-Coupon Convertible Bond
Offering |
Dec. 3, 2001 |
SONICS, NOKIA, TEXAS INSTRUMENTS, MIPS, and UMC Launch OCP-IP to Standardize IP Core Socket Interface |
Nov.26, 2001 |
XILINX and UMC Announce Successful Production on 300-mm Wafers |
Nov.2, 2001 |
Sharp Announces Strategic Agreement with UMC Group Foundry NFI |
Nov.2, 2001 |
Important Fab Status Update |
Oct. 30, 2001 |
UMC UNVEILS CHIPSIZER: Online Tool Estimates Die Size and Silicon Cost |
Oct. 30, 2001 |
UMC 3Q 2001 Financial Results |
Oct. 29, 2001 |
Mysticom, UMC Partner to Enable the Development of Highly Integrated, Communications SOCs with Mysticom's 10/100 Ethernet Physical Layer Core |
Oct. 27, 2001 |
UMC Revises Financial Forecast for Fiscal Year 2000 |
Oct. 26, 2001 |
UMC Categorically Denies Newspaper Report of SIS Fab Acquisition |
Oct. 23, 2001 |
UMC Allies with i2 to Enhance "MY UMC" Customer Supply Chain Solution |
Oct. 23, 2001 |
UMC Goes Live with Its "MY UMC" eSERVICE Solution |
Oct. 16, 2001 |
Virtual Silicon Launches Comprehensive Foundry Library Offering for UMC's 0.13 Micron Technology |
Oct. 10, 2001 |
Flextronics Semiconductor Joins UMC's ASICplus Program |
Oct. 8, 2001 |
Micronas Selects UMC's Fabs for Production of World's First Hybrid Analog/Digital TV Decoder Chip |
Oct. 5, 2001 |
UMC Revises its 2001 Financial Forecast |
Oct. 4, 2001 |
Lightcross, Inc. and UMC Successfully Fabricate New Class of Photonics Components |
Sept. 24 , 2001 |
UMC
Extends Range of 1T-SRAM® Memory Macros |
Sept. 4 , 2001 |
Conexant and UMC Sign a Long-term Semiconductor Wafer Supply Agreement |
July 31, 2001 |
UMC 2Q 2001 Financial Results |
July 23, 2001 |
UMCi Announces 300mm Fab Construction Contract Awarded to Kajima verseas Asia Pte. Ltd. |
July 17, 2001 |
Alcatel Selects UMC's 0.13-Micron Technology for Advanced Communication Products |
July 9, 2001 |
AMCC Selects UMC's 0.13-Micron Technology for the Development of Next-Generation Optical Networking Silicon |
June 15, 2001 |
UMC Mid-Quarter Business Update for the Second Quarter of 2001 |
June 14, 2001 |
UMC Statement regarding Recent Taiwan Earthquakes |
June 11, 2001 |
SiberCore Technologies and UMC Announce Fabrication of World's Highest Density Ternary CAM |
June 6, 2001 |
UMC Re-focuses Top Management |
June 4, 2001 |
UMC's ASICplus Program Chosen by Zucotto Wireless Inc. for Development of Its Xpresso Family of Java Technology-Based Processors |
May 11, 2001 |
UMC Introduces Remote Layout Viewer: Component of e-Services Suite Facilitates Design Rule Check (DRC) Signoff |
May 02, 2001 |
XILINX Announces Products on 300mm Wafers with UMC's Joint Venture Fab, TRECENTI |
Apr. 30, 2001 |
UMC
1Q 2001 Financial Results |
Apr.16, 2001 |
UMC's 0.13-Micron Technology Enables Next Generation Semiconductor Applications with Innovative "Fusion" Design Option |
Apr.12, 2001 |
UMC Holds Groundbreaking Ceremony for 300-mm Semiconductor Foundry in Singapore |
Apr. 9, 2001 |
Sharp Microelectronics of the Americas Utilizes UMC's Silicon Shuttle Program for Microcontroller and System-on-Chip Designs |
Apr. 9, 2001 |
UMC,Synopsys and Virtual Silicon Collaborate to Help Customers Get From Design Specification to silicon more Quickly |
Mar. 27, 2001 |
UMC Board Directors Proposes NT$ 1.5 Stock Dividend |
Feb 28, 2001 |
International Trade Commission Votes to Investigate Claims of SIS Infringement of UMC Patents< |
Feb 22, 2001 |
UMC First Foundry to Implement RosettaNet Stabdards for e-Business Supply Chain Management Solutions |
Feb 19, 2001 |
Mentor Graphics and UMC Deliver IC Design Kits Through Expanded Partnership |
Feb 15, 2001 |
UMC and Giga Solution Combine to Offer RF/Mixed-mode Design Kits for 0.25um, 0.18um |
Feb 14, 2001 |
UMC 4Q 2000 Financial Results |
Feb 12, 2001 |
Three-Five Systems Builds Microdisplays on UMC's Unique Liquid Crystal on Silicon(LCoS) Semiconductor Process |
Jan 30, 2001 |
Singapore's Economic Development Board to Take Equity Stake in UMC's 300mm Singapore Project |
Jan 8, 2001 |
UMC Targets Camera-on-a-Chip Developers with Enhanced CMOS Image Sensor Technology |