2001 UMC Press Releases

2001 UMC Press Releases
Dec. 18, 2001	UMC Statement Regarding Recent Taiwan Earthquake
Dec. 5, 2001	UMC Raises $302 Million Through Zero-Coupon Convertible Bond Offering
Dec. 3, 2001	SONICS, NOKIA, TEXAS INSTRUMENTS, MIPS, and UMC Launch OCP-IP to Standardize IP Core Socket Interface
Nov.26, 2001	XILINX and UMC Announce Successful Production on 300-mm Wafers
Nov.2, 2001	Sharp Announces Strategic Agreement with UMC Group Foundry NFI
Nov.2, 2001	Important Fab Status Update
Oct. 30, 2001	UMC UNVEILS CHIPSIZER: Online Tool Estimates Die Size and Silicon Cost
Oct. 30, 2001	UMC 3Q 2001 Financial Results
Oct. 29, 2001	Mysticom, UMC Partner to Enable the Development of Highly Integrated, Communications SOCs with Mysticom's 10/100 Ethernet Physical Layer Core
Oct. 27, 2001	UMC Revises Financial Forecast for Fiscal Year 2000
Oct. 26, 2001	UMC Categorically Denies Newspaper Report of SIS Fab Acquisition
Oct. 23, 2001	UMC Allies with i2 to Enhance "MY UMC" Customer Supply Chain Solution
Oct. 23, 2001	UMC Goes Live with Its "MY UMC" eSERVICE Solution
Oct. 16, 2001	Virtual Silicon Launches Comprehensive Foundry Library Offering for UMC's 0.13 Micron Technology
Oct. 10, 2001	Flextronics Semiconductor Joins UMC's ASICplus Program
Oct. 8, 2001	Micronas Selects UMC's Fabs for Production of World's First Hybrid Analog/Digital TV Decoder Chip
Oct. 5, 2001	UMC Revises its 2001 Financial Forecast
Oct. 4, 2001	Lightcross, Inc. and UMC Successfully Fabricate New Class of Photonics Components
Sept. 24 , 2001	UMC Extends Range of 1T-SRAM® Memory Macros
Sept. 4 , 2001	Conexant and UMC Sign a Long-term Semiconductor Wafer Supply Agreement
July 31, 2001	UMC 2Q 2001 Financial Results
July 23, 2001	UMCi Announces 300mm Fab Construction Contract Awarded to Kajima verseas Asia Pte. Ltd.
July 17, 2001	Alcatel Selects UMC's 0.13-Micron Technology for Advanced Communication Products
July 9, 2001	AMCC Selects UMC's 0.13-Micron Technology for the Development of Next-Generation Optical Networking Silicon
June 15, 2001	UMC Mid-Quarter Business Update for the Second Quarter of 2001
June 14, 2001	UMC Statement regarding Recent Taiwan Earthquakes
June 11, 2001	SiberCore Technologies and UMC Announce Fabrication of World's Highest Density Ternary CAM
June 6, 2001	UMC Re-focuses Top Management
June 4, 2001	UMC's ASICplus Program Chosen by Zucotto Wireless Inc. for Development of Its Xpresso Family of Java Technology-Based Processors
May 11, 2001	UMC Introduces Remote Layout Viewer: Component of e-Services Suite Facilitates Design Rule Check (DRC) Signoff
May 02, 2001	XILINX Announces Products on 300mm Wafers with UMC's Joint Venture Fab, TRECENTI
Apr. 30, 2001	UMC 1Q 2001 Financial Results
Apr.16, 2001	UMC's 0.13-Micron Technology Enables Next Generation Semiconductor Applications with Innovative "Fusion" Design Option
Apr.12, 2001	UMC Holds Groundbreaking Ceremony for 300-mm Semiconductor Foundry in Singapore
Apr. 9, 2001	Sharp Microelectronics of the Americas Utilizes UMC's Silicon Shuttle Program for Microcontroller and System-on-Chip Designs
Apr. 9, 2001	UMC,Synopsys and Virtual Silicon Collaborate to Help Customers Get From Design Specification to silicon more Quickly
Mar. 27, 2001	UMC Board Directors Proposes NT$ 1.5 Stock Dividend
Feb 28, 2001	International Trade Commission Votes to Investigate Claims of SIS Infringement of UMC Patents<
Feb 22, 2001	UMC First Foundry to Implement RosettaNet Stabdards for e-Business Supply Chain Management Solutions
Feb 19, 2001	Mentor Graphics and UMC Deliver IC Design Kits Through Expanded Partnership
Feb 15, 2001	UMC and Giga Solution Combine to Offer RF/Mixed-mode Design Kits for 0.25um, 0.18um
Feb 14, 2001	UMC 4Q 2000 Financial Results
Feb 12, 2001	Three-Five Systems Builds Microdisplays on UMC's Unique Liquid Crystal on Silicon(LCoS) Semiconductor Process
Jan 30, 2001	Singapore's Economic Development Board to Take Equity Stake in UMC's 300mm Singapore Project
Jan 8, 2001	UMC Targets Camera-on-a-Chip Developers with Enhanced CMOS Image Sensor Technology

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