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SEQUENCE,
UMC TEAM ON FIRST SILICON CORRELATION OF INDUCTANCE MODELING
Accuracy demonstrated
to be within 10 percent of silicon measurement
HSINCHU, TAIWAN, and SANTA CLARA, Calif. - SEPTEMBER
2, 2002 - Sequence Design and UMC (NYSE: UMC), a world leading semiconductor
foundry, announced today that the two companies have teamed to complete
the first ever silicon correlation of an interconnect self inductance
parasitic modeler. With this technology, UMC customers producing
technology at 150 nanometers and below can be assured that high-speed
analog and digital designs will have fewer failures due to interconnect
issues. The Columbus R, C and self-inductance interconnect modeler
libraries for UMC processes are available for download now on UMC's
website, www.umc.com.
Tuned specifically for high-frequency designers, Columbus-RF features
industry-leading modeling capabilities for RC and inductance in
RF circuits. The tool's tight integration with the industry-standard
Cadence Analog Design Environment and physical verification tools
ensures ease of use and ease of adoption.
UMC and Sequence developed a methodology to ensure accuracy of Sequence's
Columbus technology. Tests were performed on a total of 30 die at
150 nanometers with plans for similar tests at 130 and 90 nanometers,
each containing 25 unique interconnect self inductance structures.
The S-parameters were then measured and converted to inductance
values and correlated with the extracted interconnect self-inductance
parasitic values. In all cases, the extracted inductances were within
10 percent of silicon-measured values.
The project sprang from a concern both companies had about the effects
of inductance on timing and signal integrity due to interconnect
issues arising from new, advanced processes, according to Vic Kulkarni,
Sequence's president and CEO.
"UMC continues to evaluate technologies that make our silicon
the best in the industry. Inductance is an important issue that
cannot be overlooked as it is an essential physical effect that
needs to be modeled for accurate high-frequency RF high-speed digital
designs," said Tai Sheng Feng, vice president and division
director of Design Support for UMC. "Our customers often ask
for this capability, and partnering with Sequence provides them
with reliable, proven technology."
"Our continuing collaboration with UMC will provide a greater
number of IC design houses with the interconnect modeling technology
they desire," Kulkarni said. "Columbus-RF is the leading
EDA tool for extracting interconnect inductance parasitics, and
is field-proven with multiple companies. Our work with UMC validates
that our inductance technology is a winner."
About Columbus-RF
Columbus-RF is part of Sequence's ExtractionStage, a suite of high-performance
EDA tools tuned for complex multi-million-gate SoCs (systems-on-a-chip)
and analog/mixed-signal design. ExtractionStage is the only suite
of interconnect parasitic tools extracting high-accuracy resistance
(R), coupled-capacitance (C), and inductance (L) values across a
wide range of design styles.
The product has experienced significant sales growth in the past
two years, gaining more than 20 customers since its release. IBM
includes Columbus-RF in its SiGe design kits, and Qualcomm, Valence,
and LeCroy are among a growing list of customers using the product
for wireless design.
Columbus-RF was recently chosen by the readers of Wireless Systems
Design as the best wireless design tool for 2002.
About Sequence
Sequence Design, Inc., the SoC Design Closure Company, enables system-on-chip
designers to bring higher-performance and lower-power integrated
circuits quickly to fabrication. Sequence's physical design software
and solutions give its more than 100 customers the competitive advantage
they need to excel in aggressive technology markets, despite demanding
complexity and time-to-market issues of sub-180 nanometer designs.
Sequence has worldwide development and field service operations.
The company was formed through the merger of Sente, Inc., Sapphire
Design Automation, Inc. and Frequency Technology. Sequence is privately
held. Sequence is a member of Cadence Design Systems' Connections
and Mentor Graphics' Open DoorO partnership programs. Additional
information is available at sequencedesign.com.
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All trademarks mentioned herein are the property of their respective
owners.
Contacts:
UMC
KJ Communications
Eileen Elam
(650) 917-1488
kjcome@cs.com
In Taiwan:
Alex Hinnawi
(886) -2-2700-6999 ext. 6958
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Sequence
Jim Lochmiller
Public Relations for Sequence
(541) 552-0616l
ochpr@yahoo.com
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