UMC's Taiwan Fabs Gain MOE Cleaner Production Certification
Hsinchu, Taiwan, February 05, 2014 – United Microelectronics Corporation (NYSE: UMC; TSE: 2303) ("UMC"), announced today that all eight of its Taiwan-based fabs have passed the Cleaner Production Assessment Method Evaluation conducted by the Industrial Development Bureau (IDB) of the Ministry of Economic Affairs (MOE). With this certification, UMC becomes the only semiconductor manufacturer in Taiwan to obtain cleaner production certification for all its local manufacturing facilities. Fabs 8A and 12A earned the Green Factory Mark in November 2012, while Fabs 6A, 8C, 8D, 8E, 8F, and 8S recently followed with their own green certifications.
According to Po-wen Yen, UMC CEO and head of the company's Corporate Sustainability committee, "Green production and environmental protection are core concepts for UMC to realize sustainable operations, and serve as a pillar for us to better support customers. Since the initial planning of UMC's cleaner production assessment system, we have aggressively helped the government to establish related systems and continuously realized them in practice, illustrated by UMC's fabs successfully obtaining cleaner production certification. Of particular note is Fab 6A, which has been operating for a quarter century and passed this demanding certification only after continuous improvement efforts, thus showing our determination to pursue excellence. These results also prove our ability to help customers produce green products with cleaner processes that meet environmental protection and sustainable development standards."
UMC integrates environmental protection, energy saving, and carbon reduction with the company's process, product, and service strategies. Internally, it has established indicators that covers energy and water saving, waste reduction, and low carbon, with inter-fab competitions held to enhance efficiency and continuously improve. In the future, UMC will implement green building design and cleaner production management for all its new fabs to provide customers with solid technical and environmental protection support when manufacturing their products.
About the Cleaner Production Assessment Method Evaluation
The Cleaner Production Assessment Method Evaluation is the green industry standard developed and announced by the IDB to assess if a factory promotes cleaner production activities. The Semiconductor Industry Cleaner Production Assessment Method Evaluation is specifically designed for the semiconductor industry. The scoring items cover four aspects: green management and social responsibility, green production, eco design, and innovative thinking. Applicants applying for certification must pass three rounds of assessments, including document review, onsite inspection and review, and committee review.
UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry that provides advanced technology and manufacturing for applications spanning every major sector of the IC industry. UMC's robust foundry solutions allow chip designers to leverage the company's leading-edge processes, which include 28nm poly-SiON and gate-last High-K/Metal Gate technology, mixed signal/RFCMOS, and a wide range of specialty technologies. Production is supported through 10 wafer manufacturing facilities that include two advanced 300mm fabs; Fab 12A in Taiwan and Singapore-based Fab 12i. Fab 12A consists of Phases 1-4 which are in production for customer products down to 28nm. Construction has been completed for Phases 5&6, with future plans for Phases 7&8. The company employs over 15,000 people worldwide and has offices in Taiwan, mainland China, Europe, Japan, Korea, Singapore, and the United States. UMC can be found on the web at http://www.umc.com.
Note From UMC Concerning Forward-Looking Statements
Some of the statements in the foregoing announcement are forward looking within the meaning of the U.S. Federal Securities laws, including statements about future outsourcing, wafer capacity, technologies, business relationships and market conditions. Investors are cautioned that actual events and results could differ materially from these statements as a result of a variety of factors, including conditions in the overall semiconductor market and economy; acceptance and demand for products from UMC; and technological and development risks. Further information regarding these and other risks is included in UM's filings with the U.S. Securities and Exchange Commission, including its registration statements and reports on Forms F-1, F-3, F-6 and 20-F and 6-K, in each case as amended. UMC does not undertake any obligation to update any forward-looking statement as a result of new information, future events or otherwise, except as required under applicable law.