Process Technologies


Value and Performance Driven 28nm Technology

Our 28nm process technology is developed for applications that require the highest performance and power consumption characteristics. We are currently in volume production for multiple customer products on both UMC's 28HLP Poly-SiON and 28HPM/HPC High-K-Metal Gate processes. In 2015, UMC plans to aggressively add 28nm capacity to meet the high customer demand for this popular process technology.

28HLP - with enhanced Poly/SiON

UMC's 28nm High Performance Low Power (28HLP) process provides a natural migration from 40nm with easy adoption, fast-time-to-markst, and a very favorable performance / cost ratio. UMC’s Poly/SiON solution delivers vastly improved performance and power consumption for customers demanding more speed for their particular application, with a 10% speed increase over other 28nm Poly/SiON industry offerings.

28HPM/HPC - with High-k/metal gate stack

UMC's 28nm High-k/metal gate stack (28HPM/HPC) supports broad device options for increased flexibility and performance requirements, targeting a wide range of products such as application processor, cellular baseband, WLAN, Tablet, FPGA and Networking ICs. The High-k-/metal gate stack and abundant options for device voltages, memory bit-cells and under drive/overdrive capabilities help SoC designers realize unmatched performance and battery life.


Our rich 28nm technology platform and dual process approach satisfies the rigorous requirements of all major market applications.

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