Process Technologies

Advanced Technologies

40-nanometer

UMC is a leading global foundry provider of 40nm technology, having delivered customer products on this advanced process node since 2008. UMC's 40nm Low Power (40LP) platform can meet various design application needs, starting with our flexible 40nm technology design platform. Customers are then able to choose the process device options that are optimized for their specific application, such as high performance and low power transistors.

55-nanometer

UMC's ample capacity and high yield maturity for 55nm helps us realize over 30% revenue contribution from this mainstream technology node. UMC's 55nm standard performance process (55SP) is a 90% shrink from the 65nm node (65SP), providing customers with smaller die size while maintaining the same performance with similar or lower power. In addition to this standard performance platform (55SP), we also provide a Low Power platform (55LP) option that is compatible with the industry standard process. Both of these platforms are proven through multiple customer product.

65-nanometer

In June of 2005, UMC became the first foundry in the world to deliver 65nm customer products. UMC's 65nm technology supports high performance (65SP) and low power (65LL/65LP) requirements for a braod range of mainstream applications.

UMC's 65-nanometer SoC solution begins with a flexible technology design platform. Customers are able to choose the process device options that are optimized for their specific application, such as Standard Performance (SP), Low Leakage (LL) or Low Power (LP) transistors. The high performance characteristics of UMC's 65nm SP process enable designers to utilize the technology to power a broad range of applications from consumer products to graphics ICs. Technology options can also be implemented including mixed signal/RFCMOS and embedded memories (1T-RAM URAM™ Option, 0.12µm²) to further customize the process.

90-nanometer

UMC has been shipping customer products based on its 90-nanometer (0.09-µm) logic process since March of 2003.

UMC offers low-k or FSG for its 90nm manufacturing, giving customers the flexibility to choose the dielectric material best suited for their particular product application. Companies demanding performance, density, and power efficiency will benefit from UMC's 90nm technology.

Device Offerings
40LP
55LP
55SP
65LP
65LL
65SP
90LL
90SP
90G
Vdd (V)
1.05
1.2
1
1.2
1.2
1
1.2
1
1
Core Vt
Ultra Low
V
Low
V
V
V
V
V
V
V
V
Regular
V
V
V
V
V
V
V
V
V
High
V
V
V
V
V
V
V
V
V
Super HighSuper High
V
V
IO
1.8V
V
V
V
V
V
V
V
2.5UD1.8V
V
V
V
V
V
2.5V
V
V
V
V
V
V
V
V
V
2.5OD3.3V
V
V
V
V
V
V
3.3V
V
V
V
V
V
SRAM
Ultra High Density
0.499
High Density
0.242
0.425
0.425
0.525
0.525
0.99
0.99
0.99
High Current
0.303
 
0.502
   
0.62
1.16
1.16
1.16
Dual Port
0.477
0.789
0.938
0.974
0.974
1.158
2.08
2.08
2.08

 

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