We are currently in mass production for our high performance 0.15um process, which is targeted for multiple applications including computing, wired, and wireless communications. UMC's available IP/Libraries for the 0.15um process allow more than 150k logic gates/mm², and feature the industry's richest set of I/O pads and unique PLL compilers.

Technology Key Features

• Shallow trench isolation
• P-sub, Twin-Well (Epi-wafer option)
  
• Dual gate oxides
• Dual poly gate with CoSi₂
• CoSi₂ S/D
• Up to 1P7M Al (top 2 layer Cu option)
  
• 3.15 SRAM bit cell
• Wirebond / Flipchip packaging