110nm and Above

UMC maintains the world’s leading 8-inch wafer manufacturing capacity, offering process solutions from 0.35μm down to 0.11μm. We provide customers with reliable components to support their designs and products in the modern era. These process technologies deliver high manufacturing yields, low production costs, and a robust design ecosystem—meeting both reliability and cost-effectiveness requirements.

The platform is supported by a silicon-proven IP database, including standard logic cell libraries, specialized I/O, static random-access memory (SRAM), and embedded non-volatile memory (eNVM) options such as OTP and MTP. UMC also provides customized process architecture services to tailor each technology node to specific customer requirements and enhance product competitiveness.

These technologies are ideal for power management ICs, RF front-end ICs, power discrete ICs, medium- and large-size LCD driver ICs, microcontrollers (MCUs), audio ICs, and automotive electronics, enabling a broad range of applications.