HSINCHU, Taiwan, June 14, 2001 - United Microelectronics Corporation (NYSE: UMC) today reported that there was no interruption in wafer production following two strong earthquakes that shook Taiwan on the evening of June 13 and the morning of June 14. In addition, UMC facilities experienced no loss of power or any significant damage to equipment, and operations are expected to continue at normal manufacturing capabilities.

"UMC is constantly upgrading and evaluating its safety practices to better prepare for man-made and natural disasters, as demonstrated by our rapid wafer ramp-up following the 9/21 earthquake in 1999," said Robert Tsao, Chairman of UMC. "We are glad that this preparation has also helped minimize the disruption these two recent earthquakes have had on our operations and employees."