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Hsinchu, Taiwan, December 19, 2000 - United Microelectronics Corporation (UMC, NYSE: UMC), a leader in the semiconductor foundry industry, and Dai Nippon Printing Co., Ltd. (DNP), a leader in photomask manufacturing, have announced the finalization of a multi-year agreement for UMC to secure advanced mask services from DNP. The agreement also includes a joint specification optimization effort for masks at the 0.10um generation, generally considered to be the next major milestone in semiconductor process technologies.
Under the terms of the agreement, the leading photomask manufacturer will meet UMC's high-end mask demands, concentrating on the 0.15 and 0.13um process generations and with emphasis on advanced high quality Optical Proximity Correction (OPC) Phased Shift Masks (PSM). The 0.10um co-development will consist of engineering teams from both companies to research the technology and mask specifications for this high-end process, which will eventually include a very wide range of applications for UMC customers.
"This joint engineering effort gives UMC a major head start in preparing for our transition to 0.10um," said Dr. Fu Tai Liou, Senior Vice President & Chief Technology Officer at UMC
"By working with an industry leading mask provider such as DNP, our customers can be assured that their mask requirements will be met when this advanced process generation is ready."
Yoshiyuki Nakagawa, Director of DNP Semiconductor Division said, "We appreciate the high evaluation of our advanced photomask production technologies from the leading semiconductor foundry, UMC. The finalization of this long-term supply agreement will prove mutually beneficial from a cooperative as well as a business standpoint. Moreover, regarding production, our objective is to optimize 0.10um mask specification through a direct dialogue between users and suppliers, enabling a cost effective and practical supply of photomasks. This will no doubt bring substantial results to both companies."
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