UMC Presents Paper on New Hybrid High-k/Metal Gate Approach for 28nm at 2009 IEDM
Hybrid high-k/metal gate integration solution combines strengths of both gate-first and gate-last techniques
Baltimore, MD, USA, Dec. 9, 2009 – UMC (NYSE: UMC; TSE: 2303), a leading global
semiconductor foundry, presented today at the 2009 International
Electron Device Meeting (IEDM) held here, a unique 'hybrid' high-k/metal-gate
(HK/MG) technology approach for 28nm. The method combines the benefits
of 'gate-first' process strength for nMOS with 'gate-last' features
for pMOS to realize up to 30% enhanced transistor performance compared
to a gate-first only process.
"The spirit of innovation is always a key factor when developing advanced technologies," said Mr. S.C. Chien, vice president of Advanced Technology Development at UMC. "This published work demonstrates UMC's ability to conceive and develop alternative solution paths, leveraging in-depth learning of existing HK/MG process options to respond to today's rising demand for cutting-edge products and applications."
There are two different HK/MG integration schemes co-existing in the industry, gate-first and gate-last. For gate-first, the HK/MG is inserted before the gate is patterned (formed). For 'gate-last' or 'replacement metal gate', MG is 'filled in' after a polysilicon dummy gate is formed and then removed. In addition to the newly proposed hybrid approach, UMC has been developing gate-last HK/MG technology since gate-last has been proven in high volume within the industry for CPU manufacturing. The company's advanced technology development efforts are taking place at UMC's 300mm Fab and R&D complex in Tainan, Taiwan.
Note From UMC Concerning Forward-Looking Statements
Some of the statements in the foregoing announcement are forward looking within the meaning of the U.S. Federal Securities laws, including statements about future outsourcing, wafer capacity, technologies, business relationships and market conditions. Investors are cautioned that actual events and results could differ materially from these statements as a result of a variety of factors, including conditions in the overall semiconductor market and economy; acceptance and demand for products from UMC; and technological and development risks.
UMC (NYSE: UMC, TSE: 2303) is a leading global semiconductor foundry that provides advanced technology and manufacturing services for applications spanning every major sector of the IC industry. UMC's customer-driven foundry solutions allow chip designers to leverage the strength of the company's leading-edge processes, which include production proven 65nm, 45/40nm, mixed signal/RFCMOS, and a wide range of specialty technologies. Production is supported through 10 wafer manufacturing facilities that include two advanced 300mm fabs; Fab 12A in Taiwan and Singapore-based Fab 12i are both in volume production for a variety of customer products. The company employs approximately 13,000 people worldwide and has offices in Taiwan, Japan, Singapore, Europe, and the United States. UMC can be found on the web at http://www.umc.com.