HSINCHU, Taiwan - May 5, 2004—UMC, a world leading semiconductor foundry (NYSE: UMC), and AMIC technology Corporation (AMIC), a developer of a wide range of memory components and application specific design solutions, today announced the successful production of AMIC's high speed ZeBL^TM (Zero Bus Latency) SRAM on the foundry's 90nm process. The AMIC ZeBL SRAM family, scheduled for engineering samples in June 2004 and full-volume production in Q3 2004, employs a unique high-speed design methodology that is suited for high bandwidth network switching/routing and real time DSP applications.

K.L.Chen, chairman and CEO of AMIC commented, "We are proud to achieve working silicon of AMIC's ZeBL SRAM family on UMC’s 90nm process. UMC's leadership at the 90nm node will further boost the competitiveness of our products and will likely contribute to significant increases in high speed SRAM sales revenues from the billion-dollar telecom/datacom and real-time DSP market."

AMIC's first member A67P0636, a 36Mb ZeBL(1Mx36) operates at 250MHz on 2.5v/3.3v power supply and is available in a 100 pin LQFP package. This SRAM family is pin-to-pin compatible with existing industry standard high-speed SRAM products. The 90nm process enabled the ZeBL SRAM to deliver extremely high performance while maintaining a low operational current.

Jackson Hu, CEO of UMC, said, "As process technologies and designs have become more complex, UMC has continued to work closely with each customer to ensure the manufacturability of their products on our advanced processes. The production of this 90nm IC illustrates the type of success we have had with our customers at this advanced technology generation. We are pleased that our close, collaborative work with AMIC has paid off, and look forward to continuing our cooperation with them for the development of their future product lines."

In March of 2003, UMC became the first semiconductor foundry to announce the delivery of fully functional 90nm customer silicon. UMC is currently in volume production for 90nm customer products that span a variety of applications.

Some of the statements in the foregoing announcement are forward looking within the meaning of the U.S. Federal Securities laws, including statements about future outsourcing, wafer capacity, technologies, business relationships and market conditions. Investors are cautioned that actual events and results could differ materially from these statements as a result of a variety of factors, including conditions in the overall semiconductor market and economy; acceptance and demand for products; and technological and development risks.

AMIC technology develops and markets a wide range of memory components and application specific solutions. The memory portfolio is expanding rapidly and already includes SRAM, FIFO, Dual Port RAM, Pseudo-Static RAM, DRAM, EDO DRAM, SDRAM, FLASH, Quick-ROM, and mask-ROM products. For more information about AMIC technology, visit the company's website at http://www.amictechnology.com/

UMC (NYSE: UMC, TSE: 2303) is a leading global semiconductor foundry that manufactures advanced process ICs for applications spanning every major sector of the semiconductor industry. UMC delivers cutting-edge foundry technologies that enable sophisticated system-on-chip (SOC) designs, including 90nm copper, 0.13um copper, embedded DRAM, and mixed signal/RFCMOS. UMC is also a leader in 300mm manufacturing; Fab 12A in Taiwan is currently in volume production for a variety of customer products, while Singapore-based UMCi has just entered volume production. UMC employs over 8,500 people worldwide and has offices in Taiwan, Japan, Singapore, Europe, and the United States. UMC can be found on the web at http://www.umc.com.