HSINCHU, Taiwan, February 25, 2026 — United Microelectronics Corporation (NYSE: UMC; TWSE: 2303)(“UMC”), a leading global semiconductor foundry, today announced the UMC Board of Directors has approved executive changes to its leadership team, cementing the company’s succession plans while ensuring UMC’s competitiveness. Jason Wang, UMC’s Co-President, will become Chief Executive Officer. Executive Vice President Ming Hsu is named President and Chief Operating Officer of UMC, and has also been appointed a member of the Board. Co-President SC Chien has been elected to serve as Chairman of Unimicron Technology, an invested company of the UMC group.
UMC appointed Chien and Wang as Co-Presidents in 2017, who together led the company’s strategic transformation to focus on specialty process technologies serving high-growth markets. Under their leadership, UMC’s profitability improved significantly as the company won customers as a trusted foundry partner, while the company’s market capitalization has grown roughly fivefold over their tenure.
Stan Hung, Chairman of UMC, said: “Enhancing our organizational structure to keep pace with the rapidly evolving industry landscape and to position UMC to seize market opportunities has always been a core priority. The leadership changes announced today will enable UMC to further strengthen execution and raise decision-making efficiency, while ensuring continuity of our strategic direction.”
Chairman Hung added: “I would like to express my deepest gratitude to President Chien for his leadership over the years, helping UMC navigate through some of our biggest opportunities and challenges.”
New President and Chief Operating Officer, Ming Hsu, joined UMC USA in 2003 and has been a core member of the company’s senior leadership, overseeing corporate operation planning across UMC’s globally diversified sites, as well as corporate marketing, customer engineering, and business strategy.
About UMC
UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry company. The company provides high-quality IC fabrication services, focusing on logic and various specialty technologies to serve all major sectors of the electronics industry. UMC’s comprehensive IC processing technologies and manufacturing solutions include Logic/Mixed-Signal, embedded High-Voltage, embedded Non-Volatile-Memory, RFSOI, BCD etc. Most of UMC's 12-in and 8-in fabs with its core R&D are located in Taiwan, with additional ones throughout Asia. UMC has a total of 12 fabs in production with combined capacity of more than 400,000 wafers per month (12-in equivalent), and all of them are certified with IATF 16949 automotive quality standard. UMC is headquartered in Hsinchu, Taiwan, plus local offices in United States, Europe, China, Japan, Korea & Singapore, with a worldwide total of 20,000 employees. For more information, please visit: http://www.umc.com.
Note from UMC Concerning Forward-Looking Statements
Some of the statements in the foregoing announcement are forward-looking within the meaning of the U.S. Federal Securities laws, including statements about introduction of new services and technologies, future outsourcing, competition, wafer capacity, business relationships and market conditions. Investors are cautioned that actual events and results could differ materially from these statements as a result of a variety of factors, including conditions in the overall semiconductor market and economy; acceptance and demand for products from UMC; and technological and development risks. Further information regarding these and other risks is included in UMC’s filings with the U.S. Securities and Exchange Commission. UMC does not undertake any obligation to update any forward-looking statement as a result of new information, future events or otherwise, except as required under applicable law.
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