HSINCHU, Taiwan, December 3, 2025 - United Microelectronics Corporation (NYSE: UMC; TWSE: 2303)(“UMC”), a leading global semiconductor foundry, today hosted its “2025 UMC Low-Carbon Supplier Award Ceremony,” recognizing 16 supplier partners for their achievements in driving carbon emissions reduction. The top Carbon Reduction Pioneer Award was awarded to three companies—KLA, HOYA, and GlobalWafers—in recognition of their leadership and commitment to advancing decarbonization efforts across the supply chain.
SC Chien, Co-President and Chief Sustainability Officer of UMC, said: “In a rapidly evolving global environment, strengthening supply chain resilience and accelerating the net-zero transition are essential to overcoming the challenges ahead. In 2025, UMC officially received validation from the Science Based Targets initiative (SBTi) that our net-zero targets are aligned with the 1.5°C ambition. We will continue to work closely with all our partners to build a lower-carbon, more resilient supply chain.”
Since launching the Supply Chain Greenhouse Gas Inventory Initiative in 2022, UMC has supported suppliers through a strategic, step-by-step approach to greenhouse gas (GHG) inventory and emissions management. As of 2025, 422 suppliers have actively participated in the program, with the goal of engaging a total of 500 suppliers by 2027.
At this year’s ceremony, UMC honored suppliers that have demonstrated exemplary emissions reduction efforts and invited the companies to share practical experiences from their decarbonization journey. With the goal of cutting supply chain emissions by 20% by 2030, UMC will continue to support suppliers in accelerating emissions reduction from their operations while encouraging more partners to join the company’s initiative to build a more sustainable semiconductor ecosystem.
2025 Low-Carbon Supply Chain Awards Winners:
Carbon Reduction Pioneer Award
Carbon Reduction Leadership Award
Excellent Carbon Reduction Award
Carbon Reduction Recognition Award
About UMC
UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry company. The company provides high-quality IC fabrication services, focusing on logic and various specialty technologies to serve all major sectors of the electronics industry. UMC’s comprehensive IC processing technologies and manufacturing solutions include Logic/Mixed-Signal, embedded High-Voltage, embedded Non-Volatile-Memory, RFSOI, BCD etc. Most of UMC's 12-in and 8-in fabs with its core R&D are located in Taiwan, with additional ones throughout Asia. UMC has a total of 12 fabs in production with combined capacity of more than 400,000 wafers per month (12-in equivalent), and all of them are certified with IATF 16949 automotive quality standard. UMC is headquartered in Hsinchu, Taiwan, plus local offices in United States, Europe, China, Japan, Korea & Singapore, with a worldwide total of 20,000 employees. For more information, please visit: http://www.umc.com.
Note from UMC Concerning Forward-Looking Statements
Some of the statements in the foregoing announcement are forward-looking within the meaning of the U.S. Federal Securities laws, including statements about introduction of new services and technologies, future outsourcing, competition, wafer capacity, business relationships and market conditions. Investors are cautioned that actual events and results could differ materially from these statements as a result of a variety of factors, including conditions in the overall semiconductor market and economy; acceptance and demand for products from UMC; and technological and development risks. Further information regarding these and other risks is included in UMC’s filings with the U.S. Securities and Exchange Commission. UMC does not undertake any obligation to update any forward-looking statement as a result of new information, future events or otherwise, except as required under applicable law.
|
||||