UMC‘s 2.5D/3D IC solutions encompass technologies such as 2.5D through silicon interposer (TSI), deep trench capacitor (DTC), 3D wafer-to-wafer (W2W) hybrid bonding and 3D active interposers. Additionally, UMC collaborates with OSAT closely for both mass production and pathfinding exploration, furthering our customer’s products with optimal solutions, to gain a competitive edge in the AI market.
|
Technology |
Performance Enhancement |
Power Efficiency |
Smaller Form Factor |
|
2.5D TSI (w/ optional integrated DTC) |
V | V | |
|
3D W2W Hybrid Bonding/3D Active Interposer |
V | V | V |
